IP Library Granted Patent US 11,719,771
Granted Patent B1
US 11,719,771 · App. 17/805,054 · Granted Aug 8, 2023

Magnetoresistive sensor having seed layer hysteresis suppression

Inventors: Paolo Campiglio (Arcueil, FR); Samridh Jaiswal (London, GB); Yen Ting Liu (Hsinchu, TW); Maxim Klebanov (Palm Coast, FL); Sundar Chetlur (Frisco, TX)
Assignee: Allegro MicroSystems, LLC
G01R33/091H10N50/80H10N50/85G01R33/093G01R33/096G01R33/098
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Quick Facts
Patent No.
US 11,719,771
App. No.
17/805,054
Granted
Aug 8, 2023
Kind
B1
Abstract

Methods and apparatus for a magnetoresistive (MR) sensor including a seed layer having a CoFe layer for canceling hysteresis in the MR sensor. The MR stackup can include a free layer and a reference layer. The seed layer having CoFe provides a desired texturing of the stackup to cancel hysteresis effects.

Claims (34)

1. A magnetoresistive sensor, comprising

a free layer;

an insulative barrier layer;

a reference layer, wherein the free layer and the reference layer are on opposite sides of the barrier layer; and

a seed layer comprising non-adjacent first and second layers of CoFe configured to interface with the reference layer for canceling hysteresis in the magnetoresistive sensor.

2. The sensor according to claim 1 , wherein the seed layer comprises at least one layer of Cu and at least one layer of Ta.

3. The sensor according to claim 1 , wherein the seed layer comprises alternating layers of Cu and Ta.

4. The sensor according to claim 1 , wherein the first layer of CoFe is about 5 nm thick.

5. The sensor according to claim 1 , wherein the first layer of CoFe is between about 4 nm and 6 nm thick.

6. The sensor according to claim 1 , further including a bias layer adjacent the free layer to provide a double pinning configuration.

7. The sensor according to claim 1 , wherein the seed layer further comprises a layer of Ru abutting the first layer of CoFe.

8. The sensor according to claim 7 , wherein the Ru layer interfaces with the reference layer.

9. The sensor according to claim 7 , wherein the seed layer further comprises a layer of NiFe.

10. A method, comprising:

forming a free layer and a reference layer on opposite sides of an insulative barrier layer; and

interfacing the reference layer with a seed layer comprising non-adjacent first and second layers of CoFe for canceling hysteresis in a magnetoresistive sensor.

11. The method according to claim 10 , wherein the seed layer comprises at least one layer of Cu and at least one layer of Ta.

12. The method according to claim 10 , wherein the seed layer comprises alternating layers of Cu and Ta.

13. The method according to claim 10 , wherein the first layer of CoFe is about 5 nm thick.

14. The method according to claim 10 , wherein the first layer of CoFe is between about 4 nm and 6 nm thick.

15. The method according to claim 10 , further including providing a bias layer adjacent the free layer to provide a double pinning configuration.

16. The method according to claim 10 , wherein the seed layer further comprises a layer of Ru abutting the first layer of CoFe.

17. The method according to claim 16 , wherein the Ru layer interfaces with the reference layer.

18. The method according to claim 16 , wherein the seed layer further comprises a layer of NiFe.

19. A magnetoresistive sensor, comprising

a free layer;

an insulative barrier layer;

a reference layer, wherein the free layer and the reference layer are on opposite sides of the barrier layer; and

a seed layer means for canceling hysteresis in the magnetoresistive sensor, wherein the seed layer means interfaces with the reference layer,

wherein the seed layer means comprises non-adjacent first and second layers of CoFe.

20. The sensor according to claim 19 , wherein the seed layer means further comprises a layer of Ru abutting the first layer of CoFe.

21. The sensor according to claim 19 , wherein the first layer of CoFe is between about 4 nm and about 6 nm in thickness.

22. The sensor according to claim 19 , wherein the seed layer means comprises at least one layer of Cu and at least one layer of Ta.

23. The sensor according to claim 22 , wherein the first layer of CoFe is about 5 nm thick.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2022
From: CAMPIGLIO, PAOLO; JAISWAL, SAMRIDH; LIU, YEN TING; KLEBANOV, MAXIM; CHETLUR, SUNDAR; ALLEGRO MICROSYSTEMS FRANCE SAS; ALLEGRO MICROSYSTEMS EUROPE LIMITED; ALLEGRO MICROSYSTEMS BUSINESS DEVELOPMENT, INC.
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 060147/0225 →