IP Library Granted Patent US 12,543,423
Granted Patent B2
US 12,543,423 · App. 17/879,902 · Granted Feb 3, 2026

Resonant cavity micro-LED array using embedded reflector

Inventors: Thomas Wunderer (Santa Cruz, CA); Max Batres (Freemont, CA); Chris Chua (San Jose, CA)
Assignee: Genesee Valley Innovations, LLC
H10H20/862H10H20/01335H10H20/812H10H20/821H10H20/825H10H20/831G02B27/0172H10H20/032H10H20/034
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,543,423
App. No.
17/879,902
Granted
Feb 3, 2026
Kind
B2
Abstract

A light emitting diode (LED) array includes bottom reflectors patterned as an array of closed shapes on a top plane of a base layer for III-N growth. A three-dimensional III-N structure is epitaxially grown around the array of closed shapes and extending above the bottom reflectors. The three-dimensional III-N structures is a contiguous crystalline structure extending across the array. A laterally grown III-N layer is formed in contact with both the reflectors and the three-dimensional III-N structures, and III-N LED layers are grown on the laterally grown layer. One or more top reflectors are grown or deposited on the III-N LED layers and located over the bottom reflectors.

Claims (41)

1 . A light emitting diode (LED) array comprising:

a semiconductor base layer for III-N growth;

bottom reflectors patterned as an array of closed shapes on a top plane of the base layer;

a three-dimensional III-N structure epitaxially grown around the array of closed shapes and extending above the bottom reflectors, the three-dimensional III-N structure being a contiguous crystalline structure extending across the array;

a laterally grown III-N layer formed in contact with both the reflectors and the three-dimensional III-N structure;

III-N LED layers grown on the laterally grown III-N layer;

one or more top reflectors grown or deposited on the III-N LED layers and located over the bottom reflectors; and

an array of electrical contacts coupled to respective p-type materials and n-type materials of the III-N LED layers, current delivered by the electrical contacts causing non-coherent, spontaneous light emissions through one of the top reflectors or the bottom reflectors.

2 . The LED array of claim 1 , wherein the bottom or top reflectors comprise distributed Bragg reflectors (DBRs).

3 . The LED array of claim 2 , wherein the top or bottom DBRs comprise dielectric multilayer structures.

4 . The LED array of claim 1 , wherein the top reflectors comprise one or more metallic films.

5 . The LED array of claim 4 , wherein the one or more metallic films comprise one of Ag or Al.

6 . The LED array of claim 1 , wherein the bottom reflectors comprise Bragg gratings.

7 . The LED array of claim 1 , wherein the top reflectors, the bottom reflectors, and the electrical contacts form individually addressable light emitting elements that are between 0.2-20 μm in diameter.

8 . The LED array of claim 1 , wherein the base layer, the three-dimensional III-N structure, and the laterally grown III-N layer comprise an n-type material compatible with epitaxial growth of the III-N LED layers.

9 . The LED array of claim 1 , wherein the closed shapes comprise one or more of hexagons and triangles.

10 . The LED array of claim 1 , wherein the semiconductor base layer comprises III-N films on a sapphire or silicon substrate.

11 . The LED array of claim 10 , wherein the base layer comprises the silicon substrate with <111> crystal orientation.

12 . The LED array of claim 1 , wherein the three-dimensional III-N structure comprises a GaN structure.

13 . The LED array of claim 1 , wherein the non-coherent, spontaneous light emissions have a preferred directionality.

14 . The LED array of claim 1 , wherein the one of the top reflectors or the bottom reflectors through which light is emitted has a mirror reflectivity of less than 95%.

15 . An augmented or virtual reality display comprising the LED array of claim 1 .

16 . A light emitting diode (LED) comprising:

a semiconductor base layer for III-N growth;

a bottom reflector patterned as a closed shape on a top plane of the base layer;

a three-dimensional III-N structure epitaxially grown around the closed shapes and extending above the bottom reflector;

a laterally grown III-N layer formed in contact with both the reflector and the three-dimensional III-N structure;

III-N LED layers grown on the laterally grown III-N layer;

a top reflector grown or deposited on the III-N LED layers and located over the bottom reflector, the top reflector comprising a metal film; and

electrical contacts coupled to respective p-type materials and n-type materials of the III-N LED layers, current delivered by the electrical contacts causing non-coherent, spontaneous light emissions through one of the top reflector or the bottom reflector.

17 . The LED of claim 16 , wherein one or both of the bottom reflector and the top reflectors comprise distributed Bragg reflectors (DBRs).

18 . The LED of claim 16 , wherein the non-coherent, spontaneous light emissions have a preferred directionality.

19 . The LED of claim 16 , wherein the one of the top reflector or the bottom reflector through which light is emitted has a mirror reflectivity of less than 95%.

20 . The LED of claim 16 , wherein the three-dimensional III-N structure is part of a contiguous structure that extends across an array of closed shapes that defines an array of other LEDs formed on the base layer.

21 . A method comprising:

patterning bottom reflectors as an array of closed shapes on a top plane of a base layer for epitaxial growth of III-N materials;

selectively growing epitaxial three-dimensional III-N structures around and extending above the array of closed shapes, the three-dimensional III-N structures being a contiguous crystalline structure that extends across the array of closed shapes;

laterally growing a III-N layer in contact with both the bottom reflectors and the three-dimensional III-N structures;

growing III-N LED layers on the laterally grown III-N layer;

depositing or growing one or more top reflectors on the III-N LED layers; and

depositing electrical contacts on respective p-type material and n-type material of the III-N LED layers.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2025
From: XEROX CORPORATION
To: GENESEE VALLEY INNOVATIONS, LLC
Reel/Frame 073225/0116 →
SECOND LIEN NOTES PATENT SECURITY AGREEMENT Recorded Jul 2, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 071785/0550 →
FIRST LIEN NOTES PATENT SECURITY AGREEMENT Recorded Apr 11, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 070824/0001 →
SECURITY INTEREST Recorded Feb 13, 2024
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 066741/0001 →
SECURITY INTEREST Recorded Nov 20, 2023
From: XEROX CORPORATION
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 065628/0019 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVAL OF US PATENTS 9356603, 10026651, 10626048 AND INCLUSION OF US PATENT 7167871 PREVIOUSLY RECORDED ON REEL 064038 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 28, 2023
From: PALO ALTO RESEARCH CENTER INCORPORATED
To: XEROX CORPORATION
Reel/Frame 064161/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2023
From: PALO ALTO RESEARCH CENTER INCORPORATED
To: XEROX CORPORATION
Reel/Frame 064038/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2022
From: WUNDERER, THOMAS; BATRES, MAX; CHUA, CHRIS
To: PALO ALTO RESEARCH CENTER INCORPORATED
Reel/Frame 060723/0189 →
Continuity (1)
Related Publication 20240047622A1 · Feb 8, 2024
References Cited (15)
US 5324964A · Ackley · 1994 [cited by examiner]
US 6233267B1 · Nurmikko · 2001 [cited by examiner]
US 7009215B2 · Evelyn et al. · 2006 [cited by applicant]
US 8541788B2 · Denbaars et al. · 2013 [cited by applicant]
US 9653642B1 · Raring et al. · 2017 [cited by applicant]
US 10249786B2 · Batres et al. · 2019 [cited by applicant]
US 10267486B1 · Mao et al. · 2019 [cited by applicant]
US 10707374B2 · Danesh et al. · 2020 [cited by applicant]
US 20180309965A1 · Ahmed · 2018 [cited by examiner]
US 20230047142A1 · Ooi · 2023 [cited by examiner]
Zhuang et al., “630-nm red InGaN micro-light-emitting diodes (<20 μm x 20 μm) exceeding 1 mW/mm2 f full-color micro-displays,” Photonics Research, Sep. 2021;9(9):1796-1802. [cited by applicant]
Yeh et al., “GaN-Based Resonant-Cavity LEDs Featuring a Si-Diffusion-Defined Current Blocking Layer,” IEEE Photonics Technology Letters, Dec. 15, 2014; 26(24):2488-2491. [cited by applicant]
Wunderer et al., “Tree-dimensional GaN for semipolar light emitters,” Phys Status Solidi B, 2010;1-12. [cited by applicant]
Chen et al., “GaN-Based Resonant-Cavity Light-Emitting Diodes grown on Si,” Nanomaterials, 2022;12;134: 8 pgs. [cited by applicant]
Lida et al., “633-nm InGaN-based red LEDs grown on thick underlying GaN layers with reduced in-plane residual stress,” Appl. Phys. Lett, 2020;116:162101; 6 pgs. [cited by applicant]