Method and system for mass assembly of thin-film materials
A system includes a separation tool that separates a carrier wafer to form a plurality of chiplet carriers. The carrier wafer having sheets of thin film material attached. A sensor and processor of the system determine an orientation of the portions of the sheets of thin film material relative to the chiplets to determine a mapping therebetween. A fluid carrier of the system places the chiplet carriers on an assembly surface in a disordered pattern. The system includes a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping. A carrier of the system transfers the portions of the thin film material from the chiplet carriers to a target substrate.
1. A system, comprising:
a separation tool that separates a carrier wafer to form a plurality of chiplet carriers, the carrier wafer having sheets of thin film material attached thereto before the separation of the carrier wafer such that each chiplet carrier has a portion of the sheets of the thin film material attached;
a sensor and processor that determine an orientation of the portions of the sheets of the thin film material relative to the chiplets to determine a mapping therebetween;
a fluid carrier or mechanical sonication that places the chiplet carriers on an assembly surface in a disordered pattern;
a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping; and
a carrier that transfers the portions of the thin film material from the chiplet carriers to a target substrate.
2. The system of claim 1 , wherein the processor assigns a unique identifier to each of the chiplet carriers to be used in arranging the chiplet carriers from the disordered pattern to the predetermined pattern.
3. The system of claim 2 , wherein the system marks the unique identifier on each chiplet carrier.
4. The system of claim 1 , wherein the thin film material comprises a van der Waals material.
5. The system of claim 4 , wherein the van der Waals material comprises graphene.
6. The system of claim 1 , wherein the carrier wafer comprises Si with an SiO 2 coating on top.
7. The system of claim 1 , wherein the thin film material is less than a micrometer thick.
8. The system of claim 1 , wherein the micro assembler uses electrostatic forces to arrange the chiplet carriers.
9. The system of claim 1 , wherein the micro assembler arranges the chiplet carriers into desired locations and orientations.
10. The system of claim 1 , wherein the carrier comprises:
a transfer arm comprising a tacky surface that picks up the chiplet carriers from the assembly surface; and
a stamp head with protrusions that receive the portions of the thin film material from the chiplet carriers, the stamp head transferring the portions of the thin film material to the target substrate.
11. The system of claim 10 , wherein the protrusions comprise a viscoelastic, silicon-based, organic polymer, and wherein receiving the portions of the thin film material from the chiplet carriers comprises:
elevating an ambient temperature before contacting the portions of the thin film material to the protrusions;
lowering the ambient temperature after the portions of the thin film material contact the protrusions; and
separating the stamp head from the transfer arm after lowering the ambient temperature.
12. The system of claim 10 , wherein the transfer arm picks up additional chiplet carriers from the assembly surface and the stamp head receives additional portions of the thin film material from the additional chiplet carriers, the additional portions of the thin film material being stacked on the thin film material that was previously deposited to form a stack of the thin film material, wherein the stamp head transfers the stack of the thin film material to the target substrate.
13. The system of claim 1 , wherein the carrier comprises:
a stamp head with protrusions that that are brought into contact with the chiplet carriers to remove the chiplet carriers from the assembly surface; and
a tacky removal substrate that removes the chiplet carriers from the thin film material after the chiplet carriers are brought into contact with the tacky removal substrate by the stamp head, the thin film material remaining on the stamp head after the removal from the chiplet carriers.
14. The system of claim 13 , wherein the protrusions comprise a viscoelastic, silicon-based, organic polymer, and wherein the removal of the chiplet carriers from the thin film material occurs at a low ambient temperature about 39° C.
15. The system of claim 13 , wherein the stamp head picks up additional chiplet carriers from the assembly surface and removes additional portions of the thin film material from the additional chiplet carriers, the additional portions of the thin film material being stacked on the thin film material that was previously remaining on the stamp head, wherein the stamp head transfers the stack of the thin film material to the target substrate.