Multi-terminal devices using magnetoresistance elements

1. A sensor comprising:

a first metal layer portion and a second metal layer portion separated by an insulator material;

a conductive material layer in electrical contact with the first metal layer portion and the second metal layer portion; and

a tunnel magnetoresistance (TMR) element positioned on and in electrical contact with the conductive material layer,

wherein a first current is configured to flow from the first metal layer portion, through the conductive material layer, to the second metal layer portion, and

wherein a second current is configured to flow from the first metal layer portion, through the conductive material layer, through the TMR element, and exiting through a top of the TMR element.

2. The sensor of claim 1 , wherein the first current is also configured to flow through a bottom layer of the TMR element.

3. The sensor of claim 2 , wherein the bottom layer of the TMR element is a reference layer.

4. A sensor comprising:

a first metal layer portion, a second metal layer portion, and a third metal layer portion each separated by an insulator material;

a conductive material layer in electrical contact with the first, second, and third metal layer portions; and

a tunnel magnetoresistance (TMR) element positioned on and in electrical contact with the conductive layer,

wherein a first current is configured to flow from the first metal layer portion, through the conductive material layer, to the third metal layer portion, and

wherein a second current is configured to flow from the second metal layer portion, through the conductive material layer, through the TMR element, and exiting through a top of the TMR element.

5. The sensor of claim 4 , wherein the conductive material layer includes titanium nitride.

6. The sensor of claim 4 , wherein the first current is also configured to flow through a bottom layer of the TMR element.

7. The sensor of claim 4 , wherein the first current flows through a bottom layer of the TMR element, without passing through a barrier layer of the TMR element, and causes the bottom layer to increase in temperature beyond a blocking temperature of the TMR element such that current-induced degradation of the barrier layer does not occur.

8. The sensor of claim 4 , wherein the first current is controlled to cause a bottom layer of the TMR element to remain at a constant temperature.

9. The sensor of claim 4 , further comprising a thermal diode configured to monitor a temperature of a bottom layer of the TMR element.

10. The sensor of claim 9 , wherein the bottom layer of the TMR element is a reference layer.

11. The sensor of claim 4 , wherein the first current causes a planar magnetic field to be generated in the TMR element in a direction that is perpendicular to a direction of flow of the first current.

12. The sensor of claim 4 , wherein the first current includes a modulation signal configured to modify a magnetic field signal received by the TMR element, and the sensor is configured to demodulate the modified signal to determine the magnetic field signal.

13. The sensor of claim 4 , wherein the conductive material layer is a heavy metal layer that is configured to generate a transversal spin current in the TMR element in response to the first current.

14. The sensor of claim 13 , wherein the transversal spin current causes a resistance associated with the TMR element to change.

15. The sensor of claim 14 , wherein the sensor is configured to measure the first current based on a change in the resistance associated with the TMR element caused by the transversal spin current.

16. The sensor of claim 15 , wherein the change in the resistance is based on a relative orientation between a magnetization of a free layer of the TMR element and a magnetization of a reference layer of the TMR element.

17. The sensor of claim 13 , wherein the heavy metal layer includes one or more of platinum, tantalum, tungsten, and gold.

18. The sensor of claim 13 , wherein the TMR element comprises:

a free layer positioned on the heavy metal layer;

a barrier layer positioned on the free layer; and

a reference layer positioned on the barrier layer.

19. The sensor of claim 18 , wherein the barrier layer includes magnesium oxide (MgO).

20. The sensor of claim 18 , wherein the TMR element comprises a seed layer positioned beneath the heavy metal layer and a capping layer positioned on the reference layer.

21. The sensor of claim 4 , wherein the conductive material layer includes one or more coils.

22. A tunnel magnetoresistance (TMR) element comprising:

a heavy metal layer;

a free layer positioned on the heavy metal layer;

a barrier layer positioned on the free layer; and

a reference layer positioned on the barrier layer,

wherein the heavy metal layer is configured to generate a transversal spin current in the TMR element in response to a current flowing through the heavy metal layer, and wherein the transversal spin current is proportional to the current flowing through the heavy metal layer, and the transversal spin current causes a resistance of the TMR element to change.

23. The TMR element of claim 22 , further comprising:

a seed layer positioned beneath the heavy metal layer; and

a capping layer positioned on the reference layer.

24. The TMR element of claim 22 , wherein the barrier layer includes magnesium oxide (MgO).

25. The TMR element of claim 22 , wherein the change of resistance is indicative of a value of the current flowing through the heavy metal layer.