IP Library Granted Patent US 11,853,498
Granted Patent B2
US 11,853,498 · App. 18/083,111 · Granted Dec 26, 2023

System, method, and apparatus for passive shielding of a capacitive sensing button

Inventors: Mark Healy (Cork, IE); Daniel O'Keeffe (Whitechurch, IE)
Assignee: Cypress Semiconductor Corporation
G06F3/0416G01R27/2605G06F3/0446G06F2203/04107
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Quick Facts
Patent No.
US 11,853,498
App. No.
18/083,111
Granted
Dec 26, 2023
Kind
B2
Abstract

Apparatuses and methods of shielding for capacitance-to-digital code conversion are described. One apparatus includes a capacitance-to-digital converter (CDC) for measuring a self-capacitance of a sensor electrode. The capacitance-to-digital code converter can in a first phase, apply a supply voltage to the sensor electrode. The sensor electrode and a shield electrode, the form a mutual capacitance with the sensor electrode. The CDC, in a second phase, couples the shield electrode to a ground potential and the sensor electrode to a first modulation capacitor. The first modulation capacitor is pre-charged to a reference voltage. The CDC, in a third phase, couples the sensor electrode and the shield electrode to the ground potential. The CDC, in a fourth phase, couples the shield electrode to the ground potential and the sensor electrode to a second modulation capacitor. The second modulation capacitor is pre-charged to the reference voltage.

Claims (43)

1. A self capacitance measurement circuit comprising:

a sensor electrode;

a shield electrode;

a switch matrix for coupling the sensor electrode and the shield electrode to a plurality of reference voltages and to a capacitance digitizer circuit, the reference voltages comprising a drive voltage and a ground potential, wherein

in a first phase, the sensor electrode and the shield electrode are coupled to a drive voltage,

in a second phase, the sensor electrode is coupled to a first modulation capacitor and the shield electrode is coupled to the ground potential,

in a third phase, the sensor electrode and the shield electrode are coupled to the ground potential, and

in a fourth phase, the sensor electrode is coupled to a second modulation capacitor and the shield electrode is coupled to the ground potential, and

wherein the digitizer circuit is coupled to the first and second modulation capacitors and is for providing a digital output representative of the capacitance of the sensor electrode to ground.

2. The self capacitance measurement circuit of 1 , wherein the digitizer circuit is coupled to a processing circuit, the processing circuit for detecting the presence of a conductive object on the sensor electrode based on the digital output.

3. The self capacitance measurement circuit of 1 , wherein the first and second modulation capacitors have capacitance values at least two orders of magnitude greater than the capacitance of the sensor electrode to ground.

4. The self capacitance measurement circuit of 1 , wherein the shield electrode is disposed such that it substantially surrounds the sensor electrode.

5. The self capacitance measurement circuit of 1 , wherein, in the second phase, the first modulation capacitor removes charge from capacitor formed by the sensor electrode.

6. The self capacitance measurement circuit of 1 , wherein, in the fourth phase, the second modulation capacitor adds charge from capacitor formed by the sensor electrode.

7. The self capacitance measurement circuit of 1 , wherein, in the second and fourth phases, a mutual capacitance formed between the sensor electrode and the shield electrode removes charge from the first and second modulation capacitors, respectively.

8. A method for converting a capacitance on a sensor electrode to a digital value, the method comprising:

in a first phase, coupling the sensor electrode and a shield electrode to a drive voltage;

in a second phase, coupling the sensor electrode is coupled to a first modulation capacitor and coupling the shield electrode to the ground potential;

in a third phase, coupling the sensor electrode and the shield electrode to the ground potential; and

in a fourth phase, coupling the sensor electrode to a second modulation capacitor and coupling the shield electrode is coupled to the ground potential, wherein

the first and second modulation capacitors are coupled to a digitizer circuit, the digitizer circuit having an output to a processing circuit.

9. The method of claim 8 , wherein the processing circuit is for detecting the presence of a conductive object on the sensor electrode based on the output of the digitizer circuit.

10. The method of claim 8 , wherein the first and second modulation capacitors have capacitance values at least two orders of magnitude greater than the capacitance of the sensor electrode to ground.

11. The method of claim 8 , wherein the shield electrode is disposed such that it substantially surrounds the sensor electrode.

12. The method of claim 8 , wherein, in the second phase, the first modulation capacitor removes charge from capacitor formed by the sensor electrode.

13. The method of claim 8 , wherein, in the fourth phase, the second modulation capacitor adds charge from capacitor formed by the sensor electrode.

14. The method of claim 8 , wherein, in the second and fourth phases, a mutual capacitance formed between the sensor electrode and the shield electrode removes charge from the first and second modulation capacitors, respectively.

15. A capacitance measurement system comprising:

a sensor electrode;

a shield electrode; and

a sensing circuit, the sensing circuit comprising:

a plurality of inputs/outputs (IOs) coupled to the sensor electrode and the shield electrode;

a receive channel, the receive channel including a switch matrix for coupling the sensor electrode and the shield electrode to a plurality of voltage potentials and a plurality of modulation capacitors, wherein the switch matrix is for:

in a first phase, coupling the sensor electrode and the shield electrode to a drive voltage;

in a second phase, coupling the sensor electrode is coupled to a first modulation capacitor and coupling the shield electrode to the ground potential;

in a third phase, coupling the sensor electrode and the shield electrode to the ground potential; and

in a fourth phase, coupling the sensor electrode to a second modulation capacitor and coupling the shield electrode is coupled to the ground potential, wherein

the first and second modulation capacitors are coupled to a digitizer circuit, the digitizer circuit having an output to a processing circuit.

16. The capacitance measurement system of claim 15 , wherein the processing circuit is for detecting the presence of a conductive object on the sensor electrode based on the output of the digitizer circuit.

17. The capacitance measurement system of claim 15 , wherein the first and second modulation capacitors have capacitance values at least two orders of magnitude greater than the capacitance of the sensor electrode to ground.

18. The capacitance measurement system of claim 15 , wherein, in the second phase, the first modulation capacitor removes charge from capacitor formed by the sensor electrode.

19. The capacitance measurement system of claim 15 , wherein, in the fourth phase, the second modulation capacitor adds charge from capacitor formed by the sensor electrode.

20. The capacitance measurement system of claim 15 , wherein, in the second and fourth phases, a mutual capacitance formed between the sensor electrode and the shield electrode removes charge from the first and second modulation capacitors, respectively.

Assignments (2)
MERGER Recorded Nov 14, 2025
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 073571/0456 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2023
From: HEALY, MARK; O'KEEFFE, DANIEL
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 065468/0930 →
Continuity (2)
Continuation 17396220 · Aug 6, 2021
Related Publication 20230333686A1 · Oct 19, 2023