IP Library Granted Patent US 12,306,058
Granted Patent B2
US 12,306,058 · App. 18/148,517 · Granted May 20, 2025

Integrated torque sensor based on magnetostrictive effect

Inventor: Ronald Lehndorff (Mainz, DE)
Assignee: Allegro MicroSystems, LLC
G01L3/102G01L5/169
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Quick Facts
Patent No.
US 12,306,058
App. No.
18/148,517
Granted
May 20, 2025
Kind
B2
Abstract

A sensor, comprising: a supporting member; a permanent magnet that is coupled to the supporting member; and a sensor die having a plurality of sensing elements and processing circuitry formed thereon, the plurality of sensing elements being arranged to generate one or more signals in response to a pattern of magnetic flux density that is produced by the permanent magnet and modulated by an application of force to a shaft, the processing circuitry being configured to map the one or more signals to a value of a force applied to the shaft, and output an indication of the value of the force, wherein the permanent magnet and the sensor die are encapsulated in an encapsulating material, the encapsulating material being used to form a package of the sensor.

Claims (39)

1. A sensor, comprising:

a supporting member;

a permanent magnet that is coupled to the supporting member; and

a sensor die having a plurality of sensing elements and processing circuitry formed thereon, the plurality of sensing elements being arranged to generate signal in response to a pattern of magnetic flux density that is produced by the permanent magnet and modulated by a change in tensile stress in a surface of a shaft, the tensile stress resulting from an application of a twisting force to the shaft, the processing circuitry being configured to translate the signal to a value of the force, and output an indication of the value of the force,

wherein the permanent magnet and the sensor die are encapsulated in an encapsulating material, the encapsulating material being used to form a package of the sensor, and

wherein the plurality of sensing elements are arranged in a bridge circuit, the signal that is translated includes an output of the bridge circuit and the plurality of sensing elements are the only magnetic field sensing elements used in generating the indication of the value of the force.

2. The sensor of claim 1 , wherein the permanent magnet and the sensor die are disposed on opposite sides of the supporting member.

3. The sensor of claim 1 , wherein the supporting member includes at least one of a leadframe or a paddle.

4. The sensor of claim 1 , wherein the permanent magnet is coupled to the supporting member via a layer of dielectric material.

5. The sensor of claim 1 , wherein each of the plurality of sensing elements includes at least one of a receiving coil, giant magnetoresistance element (GMR), an anisotropic magnetoresistance element (AMR), a tunneling magnetoresistance element (TMR), and a magnetic tunnel junction element (MTJ).

6. A sensor, comprising:

a supporting member;

a sensor die;

a transmitting coil that is formed on the sensor die;

a plurality of sensing elements and a processing circuitry that are formed on the sensor die, the plurality of sensing elements being arranged to generate one or more signals in response to a pattern of magnetic flux density that is produced by the transmitting coil and modulated by a change in tensile stress in a surface of a shaft, the tensile stress resulting from an application of a twisting force to the shaft, the processing circuitry being configured to translate the signal to a value of the force, and output an indication of the value of the force,

wherein the supporting member and the sensor die are encapsulated in an encapsulating material, the encapsulating material being used to form a package of the sensor, and

wherein the plurality of sensing elements are arranged in a bridge circuit, the signal that is translated includes an output of the bridge circuit, and the plurality of sensing elements are the only magnetic field sensing elements used in generating the indication of the value of the force.

7. The sensor of claim 6 , wherein the supporting member includes at least one of a leadframe or a paddle.

8. The sensor of claim 7 , wherein the sensor further includes a driver for the transmitting coil, the driver being formed on the sensor die.

9. The sensor of claim 6 , wherein each of the plurality of sensing elements includes at least one of a receiving coil, giant magnetoresistance element (GMR), an anisotropic magnetoresistance element (AMR), a tunneling magnetoresistance element (TMR), and a magnetic tunnel junction element (MTJ).

10. A sensor, comprising:

a magnetic field source; and

a sensor die having a plurality of sensing elements and processing circuitry formed on the sensor die, the plurality of sensing elements being arranged to generate a plurality of signals in response to a pattern of magnetic flux density that is produced by the magnetic field source and modulated by a change in tensile stress in a surface of a shaft the tensile stress resulting from an application of a force to the shaft, the processing circuitry being configured to map a signature to a value of the force, and output an indication of the value of the force,

wherein the magnetic field source and the sensor die are encapsulated in an encapsulating material that is used to form a package of the sensor,

wherein the plurality of sensing elements includes n sensing elements, where n is a positive integer greater than one, and the signature is an n-tuple, whereby each element of the n-tuple is a respective value of a different one of the plurality of signals, and

wherein the signature is mapped to the value of the force by using a look-up table.

11. The sensor of claim 10 , further comprising a supporting member, wherein the magnetic field source includes a permanent magnet that is coupled to the supporting member.

12. The sensor of claim 11 , wherein the supporting member includes at least one of a leadframe or a paddle.

13. The sensor of claim 11 , wherein the magnetic field source and the sensor die are disposed on opposite sides of the supporting member.

14. The sensor of claim 10 , wherein the magnetic field source includes a permanent magnet and the sensor die is disposed over the permanent magnet.

15. The sensor of claim 11 , wherein the magnetic field source includes a transmitting coil, and the sensor further includes a driver for driving the transmitting coil that is formed on the sensor die.

16. The sensor of claim 11 , wherein each of the plurality of sensing elements includes at least one of a receiving coil, giant magnetoresistance element (GMR), an anisotropic magnetoresistance element (AMR), a tunneling magnetoresistance element (TMR), and a magnetic tunnel junction element (MTJ).

17. A sensor, comprising:

a permanent magnet that is coupled to an external surface of a package of the sensor; and

a sensor die having a plurality of sensing elements and processing circuitry formed thereon, the plurality of sensing elements being arranged to generate a plurality of signals in response to a pattern of magnetic flux density that is produced by the permanent magnet and modulated by a change in tensile stress in a surface of a shaft the tensile stress resulting from an application of a force to the shaft, the processing circuitry being configured to map a signature to a value of athe force, and output an indication of the value of the force,

wherein the sensor die is encapsulated in an encapsulating material, the encapsulating material being used to form the package of the sensor,

wherein the plurality of sensing elements includes n sensing elements, where n is a positive integer greater than one, and the signature is an n-tuple, whereby each element of the n-tuple is a respective value of a different one of the plurality of signals, and

wherein the signature is mapped to the value of the force by using a look-up table.

18. The sensor of claim 17 , wherein the permanent magnet is disposed in a recess that is formed in the external surface of the package of the sensor.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2022
From: LEHNDORFF, RONALD; ALLEGRO MICROSYSTEMS GERMANY GMBH; ALLEGRO MICROSYSTEMS EUROPE LIMITED
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 062244/0925 →
Continuity (1)
Related Publication 20240219248A1 · Jul 4, 2024
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