Sensor architecture for correcting thermally-induced linearity error
A current sensor comprising: a substrate; a conductor that is disposed on or adjacent to the substrate; one or more sensing elements that are formed on the substrate, the one or more sensing elements being configured to generate one or more first signals in response to a magnetic field that is associated with the conductor; and electronic circuitry that is formed on the substrate, the electronic circuitry being configured to generate a second signal based on the one or more first signals, the second signal being indicative of a level of electrical current through the conductor, wherein the electronic circuitry includes a first instance of a component, a second instance of the component, and mixing circuitry that is configured to mix an output of the first instance with an output of the second instance to produce a mixed signal.
1. A current sensor comprising:
a substrate;
a conductor that is disposed on or adjacent to the substrate;
one or more sensing elements that are formed on the substrate, the one or more sensing elements being configured to generate one or more first signals in response to a magnetic field that is associated with the conductor; and
electronic circuitry that is formed on the substrate, the electronic circuitry being configured to generate a second signal based on the one or more first signals, the second signal being indicative of a level of electrical current through the conductor,
wherein the electronic circuitry includes a first instance of a component, a second instance of the component, and mixing circuitry that is configured to mix an output of the first instance with an output of the second instance to produce a mixed signal, the mixing circuitry being arranged to provide the mixed signal to at least one of the sensing elements or a second component of the electronic circuitry, and
wherein the first instance of the component is formed in a first portion of the substrate that is adjacent to the conductor and the second instance of the component is formed in a second portion of the substrate that is situated further apart from the conductor than the first portion.
2. The current sensor of claim 1 , wherein the first portion of the substrate has a higher operating temperature than the second portion of the substrate.
3. The current sensor of claim 1 , wherein the component includes a driver for any of the one or more sensing elements.
4. The current sensor of claim 1 , wherein the component includes a sensitivity control unit.
5. The current sensor of claim 1 , wherein the component includes an offset control unit.
6. The current sensor of claim 1 , wherein the conductor includes a busbar.
7. The current sensor of claim 1 , wherein the mixing circuitry is separate of the first instance of the component and the second component.
8. The current sensor of claim 1 , wherein the mixing circuitry is configured to generate the mixed signal by calculating a weighted average of the output of the first instance and the output of the second instance.
9. The current sensor of claim 8 , wherein the output of the first instance is weighted by a first weight value and the output of the second instance is weighted by a second weight value.
10. The current sensor of claim 1 , wherein each of the sensing elements includes at least one of a giant magnetoresistor (GMR), a tunnel magnetoresistor (TMR), an anisotropic magneto resistor (AMR), a Hall plate, or a fluxgate.
11. A current sensor comprising:
a substrate;
a conductor that is disposed on or adjacent to the substrate;
one or more sensing elements that are formed on the substrate, the one or more sensing elements configured to generate one or more first signals in response to a magnetic field that is associated with the conductor; and
electronic circuitry that is formed on the substrate, the electronic circuitry being configured to generate a second signal based on the one or more first signals, the second signal being indicative of a level of electrical current through the conductor,
wherein the electronic circuitry includes a first instance of a component, a second instance of the component, and the electronic circuitry is configured to mix an output of the first instance with an output of the second instance to produce a mixed signal and use the mixed signal in generating the second signal.
12. The current sensor of claim 11 , wherein the first instance of the component is formed in a first portion of the substrate that is adjacent to the conductor and the second instance of the component is formed in a second portion of the substrate that is situated further apart from the conductor than the first portion.
13. The current sensor of claim 11 , wherein the first instance of the component is formed in a first portion of the substrate and the second instance of the component is formed in a second portion of the substrate that has a lower operating temperature than the first portion.
14. The current sensor of claim 11 , wherein the component includes a driver for any of the sensing elements.
15. The current sensor of claim 11 , wherein the component includes a sensitivity control unit.
16. The current sensor of claim 11 , wherein the component includes an offset control unit.
17. The current sensor of claim 11 , wherein mixing the output of the first instance with the output of the second instance includes calculating a weighted average of the output of the first instance and the output of the second instance.
18. The current sensor of claim 17 , wherein the output of the first instance is weighted by a first weight value and the output of the second instance is weighted by a second weight value.
19. The current sensor of claim 11 , wherein each of the sensing elements includes at least one of a giant magnetoresistor (GMR), a tunnel magnetoresistor (TMR), an anisotropic magneto resistor (AMR), a Hall plate, or a fluxgate.
20. A sensor comprising:
a substrate that is subjected to a temperature gradient during operation of the sensor;
one or more sensing elements that are formed on the substrate, the one or more sensing elements configured to generate one or more first signals in response to a stimulus; and
electronic circuitry that is formed on the substrate, the electronic circuitry being configured to generate a second signal based on the one or more first signals, the second signal being indicative of a level of the stimulus,
wherein the electronic circuitry includes a first instance of a component, a second instance of the component, and the electronic circuitry is configured to mix an output of the first instance with an output of the second instance to produce a mixed signal and use the mixed signal in generating the second signal.
21. The sensor of claim 20 , wherein the first instance of the component is formed in a first portion of the substrate and the second instance of the component is formed in a second portion of the substrate that has a lower operating temperature than the first portion.
22. The sensor of claim 21 , wherein mixing the output of the first instance with the output of the second instance includes calculating a weighted average of the output of the first instance and the output of the second instance.
23. The sensor of claim 22 , wherein the output of the first instance is weighted by a first weight value and the output of the second instance is weighted by a second weight value.
24. The sensor of claim 20 , wherein the component includes a driver for at least one of the sensing elements.
25. The sensor of claim 20 , wherein each of the sensing elements includes one of a magnetic field sensing element, a light sensing element, a pressure sensing element, a temperature sensing element, or a humidity sensing element.