IP Library Granted Patent US 12,302,080
Granted Patent B2
US 12,302,080 · App. 18/185,419 · Granted May 13, 2025

Bone conduction speaker and compound vibration device thereof

Inventors: Xin Qi (Shenzhen, CN); Fengyun Liao (Shenzhen, CN); Jinbo Zheng (Shenzhen, CN); Qian Chen (Shenzhen, CN); Hao Chen (Shenzhen, CN); Yueqiang Wang (Shenzhen, CN); Haofeng Zhang (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R9/063H04R1/00H04R1/10H04R9/02H04R9/025H04R9/066H04R31/00H04R25/606H04R2460/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,302,080
App. No.
18/185,419
Granted
May 13, 2025
Kind
B2
Abstract

The present disclosure relates to a bone conduction speaker and its compound vibration device. The compound vibration device comprises a vibration conductive plate and a vibration board, the vibration conductive plate is set to be the first torus, where at least two first rods inside it converge to its center; the vibration board is set as the second torus, where at least two second rods inside it converge to its center. The vibration conductive plate is fixed with the vibration board; the first torus is fixed on a magnetic system, and the second torus comprises a fixed voice coil, which is driven by the magnetic system. The bone conduction speaker in the present disclosure and its compound vibration device adopt the fixed vibration conductive plate and vibration board, making the technique simpler with a lower cost; because the two adjustable parts in the compound vibration device can adjust both low frequency and high frequency area, the frequency response obtained is flatter and the sound is broader.

Claims (34)

1. A speaker, comprising:

a housing;

compound vibration parts residing inside the housing and configured to generate vibrations to produce a sound wave inside the housing, wherein

the compound vibration parts include two or more vibration parts at least partially attached to each other, and

at least one hole located on the housing and configured to guide the sound wave inside the housing to an outside of the housing;

a panel connected with the compound vibration parts;

a vibration transfer layer, a portion of the vibration transfer layer being in contact with the panel, and a portion not being in contact with the panel on the vibration transfer layer having one or more holes configured to guide the sound wave inside the housing to the outside of the housing;

at least two microphones, the at least two microphones including a first microphone with a first orientation and a second microphone with a second orientation different from the first orientation.

2. The speaker according to claim 1 , wherein at least two of the two or more vibration parts having different stiffness coefficients.

3. The speaker according to claim 1 , wherein the two or more vibration parts overlap each other.

4. The speaker according to claim 1 , wherein a thickness of at least one of the two or more vibration parts is in a range of 0.02 mm-0.5 mm.

5. The speaker according to claim 1 , wherein the first microphone and the second microphone are disposed at different positions of a flexible circuit board, wherein the flexible circuit board is disposed in the speaker.

6. The speaker according to claim 5 , wherein the flexible circuit board includes a main circuit board, a first branch circuit board, and a second branch circuit board, wherein the first branch circuit board and the second branch circuit board are connected to the main circuit board.

7. The speaker according to claim 6 , wherein the second branch circuit board extends perpendicular to the main circuit board.

8. The speaker according to claim 7 , wherein the second microphone is disposed on one end of the second branch circuit board away from the main circuit board.

9. The speaker according to claim 6 , wherein the first microphone is disposed on one end of the first branch circuit board away from the main circuit board.

10. The speaker according to claim 5 , wherein the first microphone and the second microphone are disposed on a first side of the flexible circuit board.

11. The speaker according to claim 10 , wherein a microphone rigid support plate is disposed on a second side of the flexible circuit board, the second side being different from the first side.

12. The speaker according to claim 11 , wherein the microphone rigid support plate includes a first rigid support plate for supporting the first microphone and a second rigid support plate for supporting the second microphone.

13. The speaker according to claim 1 , wherein the housing includes a peripheral side wall and a bottom end wall, wherein the first microphone is fixed on the bottom end wall, and the second microphone is fixed on the peripheral side wall.

14. The speaker according to claim 1 , further comprising a voice coil, wherein the voice coil is driven by a magnetic component and fixed on at least part of the two or more vibration parts.

15. The speaker according to claim 14 , wherein the magnetic component comprises:

a bottom plate;

an annular magnet attaching to the bottom plate;

an inner magnet concentrically disposed inside the annular magnet;

an inner magnetic conductive plate attaching to the inner magnet;

an annular magnetic conductive plate attaching to the annular magnet; and

a grommet attaching to the annular magnetic conductive plate.

16. The speaker according to claim 1 , wherein the vibrations causes a leaked sound wave spreading outside the housing; and the guided sound wave through the at least one hole interferes with the leaked sound wave.

17. The speaker according to claim 1 , wherein the at least one hole on the housing includes at least two holes.

18. The speaker according to claim 1 , wherein the portion being in contact with the panel on the vibration transfer layer is higher than the portion not being in contact with the panel on the vibration transfer layer to form a step structure.

19. The speaker according to claim 1 , wherein the compound vibration parts and the vibration transfer layer are located on opposite sides of the panel.

20. The speaker according to claim 1 , wherein the vibration transfer layer is configured to produce a certain deformation to match a user's skin; and

the vibrations are transferred to human bones through the panel.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2023
From: QI, XIN; LIAO, FENGYUN; ZHENG, JINBO; CHEN, QIAN; CHEN, HAO; WANG, YUEQIANG; ZHANG, HAOFENG
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 064783/0783 →
CHANGE OF NAME Recorded Sep 3, 2023
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 064783/0790 →
Priority Claims (2)
CN 201110438083.9 · Dec 23, 2011 · national
CN 201810975515.1 · Aug 24, 2018 · national
Continuity (12)
Continuation 17218279 · Mar 31, 2021
Continuation In Part 17170817 · Feb 8, 2021
Continuation 17161717 · Jan 29, 2021
Continuation In Part 16159070 · Oct 12, 2018
Continuation 15197050 · Jun 29, 2016
Continuation 14513371 · Oct 14, 2014
Continuation 13719754 · Dec 19, 2012
Continuation In Part 16833839 · Mar 30, 2020
Continuation 15752452
Continuation In Part 16950876 · Nov 17, 2020
Continuation PCTCN2019102394 · Aug 24, 2019
Related Publication 20230224644A1 · Jul 13, 2023
References Cited (193)
US 2075196A · Hand · 1937 [cited by applicant]
US 4418248A · Mathis · 1983 [cited by examiner]
US 4791673A · Schreiber · 1988 [cited by applicant]
US 5127060A · Paddock · 1992 [cited by examiner]
US 5280524A · Norris · 1994 [cited by applicant]
US 5673328A · Wandl et al. · 1997 [cited by applicant]
US 5734132A · Proni · 1998 [cited by applicant]
US 5745209A · Khantzis · 1998 [cited by applicant]
US 5790684A · Niino · 1998 [cited by examiner]
US 6389148B1 · Yoo et al. · 2002 [cited by applicant]
US 6456721B1 · Fukuda · 2002 [cited by applicant]
US 6668065B2 · Lee et al. · 2003 [cited by applicant]
US 6738485B1 · Boesen · 2004 [cited by applicant]
US 6850138B1 · Sakai · 2005 [cited by applicant]
US 7289767B2 · Lai · 2007 [cited by applicant]
US 7639825B2 · Fukuda · 2009 [cited by applicant]
US 7822215B2 · Carazo et al. · 2010 [cited by applicant]
US 8325964B2 · Weisman · 2012 [cited by applicant]
US 8433082B2 · Abolfathi · 2013 [cited by applicant]
US 8447061B2 · Lee · 2013 [cited by applicant]
US 8520867B2 · Koike et al. · 2013 [cited by applicant]
US 8526641B2 · Parker et al. · 2013 [cited by applicant]
US 8553910B1 · Dong et al. · 2013 [cited by applicant]
US 8660278B2 · Abolfathi et al. · 2014 [cited by applicant]
US 8699742B2 · Heiman et al. · 2014 [cited by applicant]
US 8737649B2 · Parker et al. · 2014 [cited by applicant]
US 8891792B2 · Qi et al. · 2014 [cited by applicant]
US 8908891B2 · Mersky · 2014 [cited by applicant]
US 9226075B2 · Lee · 2015 [cited by applicant]
US 9253563B2 · Fukuda · 2016 [cited by applicant]
US 9344804B2 · Chen · 2016 [cited by examiner]
US 9742887B2 · Hosoi et al. · 2017 [cited by applicant]
US 10609496B2 · Liao et al. · 2020 [cited by applicant]
US 11140497B2 · Liao et al. · 2021 [cited by applicant]
US 11323830B2 · Liao et al. · 2022 [cited by applicant]
US 11323832B2 · Liao et al. · 2022 [cited by applicant]
US 11343623B2 · Liao et al. · 2022 [cited by applicant]
US 11343624B2 · Liao et al. · 2022 [cited by applicant]
US 11343625B2 · Liao et al. · 2022 [cited by applicant]
US 11368800B2 · Qi et al. · 2022 [cited by applicant]
US 11399245B2 · Liao et al. · 2022 [cited by applicant]
US 11438717B2 · Liao et al. · 2022 [cited by applicant]
US 11463814B2 · Qi et al. · 2022 [cited by applicant]
US 11570560B2 · Liao et al. · 2023 [cited by applicant]
US 11601761B2 · Qi et al. · 2023 [cited by applicant]
US 11611837B2 · Liao et al. · 2023 [cited by applicant]
US 12156000B2 · Liao et al. · 2024 [cited by applicant]
US 20030012395A1 · Fukuda · 2003 [cited by applicant]
US 20030053651A1 · Koura et al. · 2003 [cited by applicant]
US 20040105566A1 · Matsunaga et al. · 2004 [cited by applicant]
US 20040131218A1 · Dedieu et al. · 2004 [cited by applicant]
US 20050129257A1 · Tamura · 2005 [cited by applicant]
US 20050254672A1 · Kobayashi · 2005 [cited by applicant]
US 20060018488A1 · Viala et al. · 2006 [cited by applicant]
US 20060098829A1 · Kobayashi · 2006 [cited by examiner]
US 20060165246A1 · Lee et al. · 2006 [cited by applicant]
US 20060262954A1 · Lee et al. · 2006 [cited by applicant]
US 20060286998A1 · Fukuda · 2006 [cited by applicant]
US 20070053536A1 · Westerkull · 2007 [cited by applicant]
US 20070053542A1 · Lee · 2007 [cited by applicant]
US 20080074609A1 · Ifergan · 2008 [cited by applicant]
US 20080144874A1 · Wu · 2008 [cited by examiner]
US 20080166007A1 · Hankey et al. · 2008 [cited by applicant]
US 20090097681A1 · Puria et al. · 2009 [cited by applicant]
US 20090209806A1 · Hakansson · 2009 [cited by applicant]
US 20090243964A1 · Rottenkolber et al. · 2009 [cited by applicant]
US 20090245553A1 · Parker · 2009 [cited by applicant]
US 20090285417A1 · Shin et al. · 2009 [cited by applicant]
US 20100046783A1 · Huang · 2010 [cited by applicant]
US 20100316235A1 · Park et al. · 2010 [cited by applicant]
US 20100329485A1 · Fukuda · 2010 [cited by applicant]
US 20110022119A1 · Parker · 2011 [cited by applicant]
US 20120020501A1 · Lee · 2012 [cited by examiner]
US 20120281861A1 · Lin · 2012 [cited by applicant]
US 20120286765A1 · Heuvel et al. · 2012 [cited by applicant]
US 20120302822A1 · Van Himbeeck et al. · 2012 [cited by applicant]
US 20130039520A1 · Margolis et al. · 2013 [cited by applicant]
US 20130121513A1 · Adachi · 2013 [cited by applicant]
US 20130156241A1 · Jinton · 2013 [cited by applicant]
US 20130201438A1 · Gasparetto · 2013 [cited by applicant]
US 20130259271A1 · Miyoshi et al. · 2013 [cited by applicant]
US 20130308798A1 · Lee · 2013 [cited by applicant]
US 20140064533A1 · Kasic, II · 2014 [cited by applicant]
US 20140185822A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140185837A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140270293A1 · Ruppersberg et al. · 2014 [cited by applicant]
US 20140274229A1 · Fukuda · 2014 [cited by applicant]
US 20150130945A1 · Yu et al. · 2015 [cited by applicant]
US 20150208183A1 · Bern · 2015 [cited by applicant]
US 20150230034A1 · Kaplan · 2015 [cited by applicant]
US 20150256911A1 · Lucas et al. · 2015 [cited by applicant]
US 20150264473A1 · Fukuda · 2015 [cited by applicant]
US 20150319526A1 · Kunimoto et al. · 2015 [cited by applicant]
US 20160037243A1 · Lippert et al. · 2016 [cited by applicant]
US 20160127841A1 · Horii · 2016 [cited by applicant]
US 20160246076A1 · Wei · 2016 [cited by applicant]
US 20160295328A1 · Park · 2016 [cited by applicant]
US 20170164088A1 · Fukuda · 2017 [cited by applicant]
US 20170208398A1 · Ruppersberg et al. · 2017 [cited by applicant]
US 20170374479A1 · Qi et al. · 2017 [cited by applicant]
US 20190014425A1 · Liao et al. · 2019 [cited by applicant]
US 20190204617A1 · Yang et al. · 2019 [cited by applicant]
US 20190238971A1 · Wakeland et al. · 2019 [cited by applicant]
US 20200228902A1 · Liao et al. · 2020 [cited by applicant]
US 20210014587A1 · Cai et al. · 2021 [cited by applicant]
US 20210165243A1 · Wang et al. · 2021 [cited by applicant]
US 20210250694A1 · Qi et al. · 2021 [cited by applicant]
US 20210250700A1 · Qi et al. · 2021 [cited by applicant]
US 20220240029A1 · Liao et al. · 2022 [cited by applicant]
CN 1842019A · 2006 [cited by applicant]
CN 1976541A · 2007 [cited by applicant]
CN 102497612A · 2012 [cited by applicant]
CN 202306037U · 2012 [cited by applicant]
CN 202435598U · 2012 [cited by applicant]
CN 203786416U · 2014 [cited by applicant]
CN 204272346 · 2015 [cited by examiner]
CN 105007551A · 2015 [cited by applicant]
CN 105101019A · 2015 [cited by applicant]
CN 105101020A · 2015 [cited by applicant]
CN 105142077A · 2015 [cited by applicant]
CN 204887455U · 2015 [cited by applicant]
CN 205142506U · 2016 [cited by applicant]
CN 205301727U · 2016 [cited by applicant]
CN 206292473U · 2017 [cited by applicant]
CN 206563855U · 2017 [cited by applicant]
CN 206920741U · 2018 [cited by applicant]
CN 207443120U · 2018 [cited by applicant]
CN 207718105U · 2018 [cited by applicant]
CN 109061902A · 2018 [cited by applicant]
CN 208780926U · 2019 [cited by applicant]
CN 208780932U · 2019 [cited by applicant]
CN 208847981U · 2019 [cited by applicant]
CN 209184747U · 2019 [cited by applicant]
EP 1404146A1 · 2004 [cited by applicant]
EP 1603362A1 · 2005 [cited by applicant]
EP 2234413B1 · 2020 [cited by applicant]
JP S5574290A · 1980 [cited by applicant]
JP 07007797A · 1995 [cited by applicant]
JP 2003264882A · 2003 [cited by applicant]
JP 2004064457A · 2004 [cited by applicant]
JP 2004158961A · 2004 [cited by applicant]
JP 2005151183A · 2005 [cited by applicant]
JP 2006025333A · 2006 [cited by applicant]
JP 2006157318A · 2006 [cited by applicant]
JP 2007129384A · 2007 [cited by applicant]
JP 2008017398A · 2008 [cited by applicant]
JP 2008054063A · 2008 [cited by applicant]
JP 2011160175A · 2011 [cited by applicant]
JP 2013243564A · 2013 [cited by applicant]
KR 20000013328 · 2000 [cited by examiner]
KR 20000013328A · 2000 [cited by applicant]
KR 20010111653A · 2001 [cited by applicant]
KR 20050030183A · 2005 [cited by applicant]
KR 20070122104A · 2007 [cited by applicant]
KR 20080101166A · 2008 [cited by applicant]
KR 20090082999A · 2009 [cited by applicant]
KR 20090091378A · 2009 [cited by applicant]
KR 20110037483A · 2011 [cited by applicant]
KR 200476572Y1 · 2015 [cited by applicant]
KR 101819530B1 · 2018 [cited by applicant]
WO 0219759A1 · 2002 [cited by applicant]
WO 2006088410A1 · 2006 [cited by applicant]
WO 2007034739A1 · 2007 [cited by applicant]
WO 2010110713A1 · 2010 [cited by applicant]
WO 2010114195A1 · 2010 [cited by applicant]
WO 2019035558A1 · 2019 [cited by applicant]
Paula Henry et al., Bone Conduction: Anatomy, Physiology, and Communication, Army Research Laboratory, 2007, 206 pages. [cited by applicant]
Office Action in Brazilian Application No. 11 2018 002854 1 mailed on Feb. 24, 2023, 8 pages. [cited by applicant]
Notice of Rejection in Japanese Application No. 2020-088413 mailed on Apr. 4, 2023, 9 pages. [cited by applicant]
First Office Action in Chinese Application No. 201110438083.9 mailed on Sep. 27, 2012, 10 pages. [cited by applicant]
The Extended European Search Report in European Application No. 12860348.7 mailed on Apr. 28, 2015, 7 pages. [cited by applicant]
International Search Report in PCT/CN2012/086513 mailed on Mar. 14, 2013, 5 pages. [cited by applicant]
Written Opinion in PCT/CN2012/086513 mailed on Mar. 14, 2013, 10 pages. [cited by applicant]
International Search Report in PCT/CN2015/086907 mailed on May 6, 2016, 10 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2018-506985 mailed on Sep. 3, 2019, 8 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2018-146019 mailed on Jul. 23, 2019, 8 pages. [cited by applicant]
Decision of Final Rejection in Japanese Application No. 2018-146019 mailed on Jan. 21, 2020, 9 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2018-146020 mailed on Jul. 23, 2019, 8 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2018-146021 mailed on Jul. 30, 2019, 8 pages. [cited by applicant]
Decision to Grant a Patent in Japanese Application No. 2018-146021 mailed on Jul. 21, 2020, 5 pages. [cited by applicant]
Brief Summary of a Notice of Preliminary Rejection in Republic of Korea Application No. 10-2018-7007115 mailed on May 20, 2021, 9 pages. [cited by applicant]
International Search Report in PCT/CN2019/102394 mailed on Nov. 28, 2019, 8 pages. [cited by applicant]
Written Opinion in PCT/CN2015/086907 mailed on May 6, 2016, 12 pages. [cited by applicant]
Written Opinion in PCT/CN2019/102394 mailed on Nov. 28, 2019, 10 pages. [cited by applicant]
Notice of Rejection in Japanese Application No. 2020-088413 mailed on Aug. 3, 2021, 7 pages. [cited by applicant]
M. Gripper et al., Using the Callsign Acquisition Test (CAT) to Compare the Speech Intelligibility of Air Versus Bone Conduction, International Journal of Industrial Ergonomics, 37(7): 631-641, 2007. [cited by applicant]
Martin L. Lenhardt et al., Measurement of Bone Conduction Levels for High Frequencies, International Tinnitus Journal, 8(1): 9-12, 2002. [cited by applicant]
The Extended European Search Report in European Application No. 21186537.3 mailed on Nov. 9, 2021, 9 pages. [cited by applicant]
Notice of Preliminary Rejection in Korean Application No. 10-2022-7003237 mailed on Apr. 13, 2022, 14 pages. [cited by applicant]
Notice of Reasons for Refusal in Japanese Application No. 2020-088413 mailed on Sep. 6, 2022, 11 pages. [cited by applicant]
The Second Notice of Preliminary Rejection in Korean Application No. 10-2022-7003237 mailed on Oct. 11, 2022, 14 pages. [cited by applicant]
Notice of Reasons for Refusal in Japanese Application No. 2021-179711 mailed on Oct. 18, 2022, 8 pages. [cited by applicant]
The Office Action in Brazilian Application No. BR102018067834-5 mailed on Jul. 5, 2024, 8 pages. [cited by applicant]