IP Library Patent Application 18304617
Patent Application
App. No. 18/304,617

METHOD AND SYSTEM FOR TESTING A CHIP

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Quick Facts
Patent No.
US None
App. No.
18/304,617
Abstract

A method and a system for testing various types of chips includes: registering, by a tester connected to a chip, a model pattern of signals; receiving, by the tester via no more than a single cable, an output signal generated by the chip based on a test signal generated by the tester or by an image sensor connected to the chip; comparing, by the tester, a pattern in the output signal with the model pattern of signals; and displaying, by a display, a test result based on a comparison of the pattern in the output signal with the model pattern of signals.

Claims (27)

1 . A testing method for a chip, comprising:

registering, by a tester connected to the chip, a model pattern of signals;

receiving, by the tester via no more than a single cable, an output signal generated by the chip based on a test signal generated by the tester or by an image sensor connected to the chip;

comparing, by the tester, a pattern in the output signal with the model pattern of signals; and

displaying, by a display, a test result based on a comparison of the pattern in the output signal with the model pattern of signals.

2 . The testing method of claim 1 , wherein the comparing of the pattern in the output signal with the model pattern of signals is performed by a test chip on the tester.

3 . The testing method of claim 1 , wherein the output signal is aggregated with other signals including a command response of the image sensor, and the output signal aggregated with the other signals is received via the signal cable.

4 . The testing method of claim 1 , wherein the single cable is a Universal Serial Bus (USB) cable.

5 . The testing method of claim 1 , wherein the model pattern of signals is an artificial pattern of signals.

6 . The testing method of claim 3 , further comprising:

registering, by the tester, a redefined model pattern of signals in response to a reconfiguration of the chip.

7 . The testing method of claim 1 , further comprising:

transmitting, by the image sensor, the test signal to the chip via a Mobile Industry Processor Interface (MIPI) cable.

8 . A system for testing a chip, comprising:

a tester connected to the chip; and

a display connected to the tester,

wherein the tester:

registers a model pattern of signals;

receives, via no more than a single cable, an output signal generated by the chip based on a test signal generated by the tester or an image sensor connected to the chip;

compares a pattern in the output signal with the model pattern of signals; and

causes the display to display a test result based on a comparison of the pattern in the output signal with the model pattern of signals.

9 . The system according to claim 8 , wherein the tester comprises a test chip that compares the pattern in the output signal with the model pattern of signals.

10 . The system according to claim 8 , wherein the output signal is aggregated with other signals including a command response of the image sensor, and the output signal aggregated with the other signals is received via the signal cable.

11 . The system according to claim 8 , wherein the single cable is a Universal Serial Bus (USB) cable.

12 . The system according to claim 8 , wherein the model pattern of signals is an artificial pattern of signals.

13 . The system according to claim 10 , wherein the tester further registers a redefined model pattern of signals in response to a reconfiguration of the chip.

14 . The system according to claim 8 , wherein the image sensor transmits the test signal via a Mobile Industry Processor Interface (MIPI) cable.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2023
From: LENOVO (UNITED STATES) INC.
To: LENOVO (SINGAPORE) PTE. LTD.
Reel/Frame 064222/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2023
From: YANG, XUEYONG; YAMAZAKI, SATOSHI
To: LENOVO (UNITED STATES) INC.
Reel/Frame 063549/0818 →