IP Library Granted Patent US 12,027,745
Granted Patent B2
US 12,027,745 · App. 18/333,655 · Granted Jul 2, 2024

Hybrid coupler and method for manufacturing hybrid couplers

Inventors: Kamalakar Yeddula (Nandyala, IN); NBVS Krishna (Pamarru, IN); Rakesh Kalwani (Margao, IN); Kumara Swamy Kasani (Godavarikhani, IN)
Assignee: CommScope Technologies LLC
H01P5/16H01P3/08H01Q9/16H05K1/0237
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Quick Facts
Patent No.
US 12,027,745
App. No.
18/333,655
Granted
Jul 2, 2024
Kind
B2
Abstract

A hybrid coupler is disclosed. The hybrid coupler comprises a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer. The first metallization layer comprises at least two input ports and at least two output ports. The hybrid coupler further comprises a plurality of couplers coupled adjacent to each other on the first metallization layer. Each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer. The hybrid coupler furthermore comprises a defective ground structure having a pre-defined shape defined in the second metallization layer below each coupling junction formed between the transmission traces of the plurality of couplers.

Claims (30)

1. A hybrid coupler, comprising:

a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer, the first metallization layer comprising at least two input ports and at least two output ports;

a plurality of couplers coupled adjacent to each other on the first metallization layer, each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer; and

a defective ground structure having a pre-defined shape defined in the second metallization layer below at least one coupling junction formed between the transmission traces of the plurality of couplers.

2. The hybrid coupler as claimed in claim 1 , wherein the pre-defined shape of the defective ground structure is in shape of a rectangle, rhombus, square, flare dumbbell, triangular dumbbell, circular dumbbell, square dumbbell or rectangular dumbbell.

3. The hybrid coupler as claimed in claim 1 , wherein the hybrid coupler comprises four coupler units on the first metallization layer.

4. The hybrid coupler as claimed in claim 1 , wherein the defective ground structure is configured to increase an electrical length of traces extending between the transmission traces for achieving uniform power distribution across a frequency band of 1.695 MHz to 2.690 MHz.

5. The hybrid coupler as claimed in claim 4 , wherein the electrical length of traces extending between the transmission traces is 25 mm.

6. The hybrid coupler as claimed in claim 1 , wherein the defective ground structure has a length of 9.40 mm and a width of 6.90 mm.

7. The hybrid coupler as claimed in claim 1 , wherein the hybrid coupler is a 3 dB 90-degree hybrid coupler.

8. The hybrid coupler as claimed in claim 1 , wherein the defective ground structure comprises one or more cut-outs defined in a ground plane layer of the second metallization layer.

9. A method of manufacturing a hybrid coupler, the method comprising:

designing a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer, the first metallization layer comprising at least two input ports and at least two output ports;

providing a plurality of couplers coupled adjacent to each other on the first metallization layer, each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer; and

defining a defective ground structure having a pre-defined shape in the second metallization layer below at least one coupling junction formed between the transmission traces of the plurality of couplers.

10. The method as claimed in claim 9 , wherein defining the defective ground structure in the pre-defined shape comprises defining the defective ground structure in a shape of a rectangle, rhombus, square, flare dumbbell, triangular dumbbell, circular dumbbell, square dumbbell or rectangular dumbbell.

11. A twin bean twin-beam antenna comprising:

a hybrid coupler adapted to mount radiating elements thereon, the hybrid coupler comprising:

a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer, the first metallization layer comprising at least two input ports and at least two output ports;

a plurality of couplers coupled adjacent to each other on the first metallization layer, each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer; and

a defective ground structure having a pre-defined shape defined in the second metallization layer below at least one coupling junction formed between the transmission traces of the plurality of couplers.

12. The twin-beam antenna as claimed in claim 11 , wherein the pre-defined shape of the defective ground structure is in a shape of a rectangle, rhombus, square, flare dumbbell, triangular dumbbell, circular dumbbell, square dumbbell or rectangular dumbbell.

13. The twin-beam antenna as claimed in claim 11 , wherein the hybrid coupler comprises four coupler units on the first metallization layer.

14. The twin-beam antenna as claimed in claim 11 , wherein the defective ground structure is configured to increase an electrical length of traces extending between the transmission traces for achieving uniform power distribution across a frequency band of 1.695 MHz to 2.690 MHz.

15. The twin-beam antenna as claimed in claim 14 , wherein the electrical length of the traces extending between the transmission traces is 25 mm.

16. The twin-beam antenna as claimed in claim 11 , wherein the defective ground structure has a length of 9.40 mm and width of 6.90 mm.

17. The twin-beam antenna as claimed in claim 11 , wherein the hybrid coupler is a 3 dB 90-degree hybrid coupler.

18. The twin-beam antenna as claimed in claim 11 , wherein the radiating elements are arranged in a staggered arrangement.

19. The twin-beam antenna as claimed in claim 18 , wherein the staggered arrangement of the radiating elements comprises horizontal layout, vertical layout, offset layout, or a combination layout thereof, of the radiating elements.

20. The twin-beam antenna as claimed in claim 11 , wherein the defective ground structure comprises one or more cut-outs defined in a ground plane layer of the second metallization layer.

Assignments (9)
PARTIAL TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 7, 2025
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 070154/0183 →
PARTIAL TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 069889/FRAME 0114 Recorded Feb 7, 2025
From: APOLLO ADMINISTRATIVE AGENCY LLC
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 070154/0341 →
RELEASE (REEL 068770 / FRAME 0460) Recorded Feb 7, 2025
From: JPMORGAN CHASE BANK, N.A.
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 070149/0432 →
RELEASE OF SECURITY INTEREST AT REEL/FRAME 068770/0632 Recorded Dec 19, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 069743/0264 →
SECURITY INTEREST Recorded Dec 17, 2024
From: ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE INC., OF NORTH CAROLINA; OUTDOOR WIRELESS NETWORKS LLC; RUCKUS IP HOLDINGS LLC
To: APOLLO ADMINISTRATIVE AGENCY LLC
Reel/Frame 069889/0114 →
PATENT SECURITY AGREEMENT (ABL) Recorded Aug 26, 2024
From: OUTDOOR WIRELESS NETWORKS LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 068770/0460 →
PATENT SECURITY AGREEMENT (TERM) Recorded Aug 26, 2024
From: OUTDOOR WIRELESS NETWORKS LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 068770/0632 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2024
From: COMMSCOPE TECHNOLOGIES LLC
To: OUTDOOR WIRELESS NETWORKS LLC
Reel/Frame 068107/0089 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2023
From: YEDDULA, KAMALAKAR; KRISHNA, NBVS; KALWANI, RAKESH; KASANI, KUMARA SWAMY
To: COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 063932/0852 →
Continuity (2)
Provisional Application 63395928 · Aug 8, 2022
Related Publication 20240047844A1 · Feb 8, 2024