Multipurpose electric field shield for wireless power transfer systems
A wireless power transfer system is disclosed. The system includes a wireless power transmitter including a transmitter coil and a transmitter electric field shield disposed over the transmitter coil. The transmitter electric field shield includes a first printed circuit board (PCB) and a second PCB. Each of the first and second PCBs includes a number of apertures. The apertures of the first PCB do not overlap with the apertures of the second PCB. The system further includes a wireless power receiver including a receiver coil and a receiver electric field shield disposed over or underneath the receiver coil. The receiver electric field shield includes a PCB having a first layer and a second layer connected to one another. The first layer of the PCB mates with the receiver coil and the second layer of the PCB mates with an interface surface of the wireless power receiver.
1. A wireless power transfer system, comprising:
a wireless power transmitter comprising a transmitter coil and a transmitter electric field shield disposed over the transmitter coil, the transmitter electric field shield comprising a first printed circuit board (PCB) and a second PCB, wherein the first PCB is disposed over the second PCB with a space therebetween, each of the first and second PCBs includes a plurality of apertures, and the apertures of the first PCB do not overlap with the apertures of the second PCB; and
a wireless power receiver comprising a receiver coil and a receiver electric field shield disposed underneath the receiver coil, the receiver electric field shield comprising a PCB having a first layer and a second layer connected to one another, wherein the first layer of the PCB mates with the receiver coil and the second layer of the PCB mates with an interface surface of the wireless power receiver.
2. The wireless power transfer system of claim 1 , wherein the second PCB of the transmitter electric field shield further includes a plurality of traces to block electric field generated by the transmitter coil and allow magnetic field generated by the transmitter coil to pass.
3. The wireless power transfer system of claim 2 , wherein the traces have open-ended patterns.
4. The wireless power transfer system of claim 2 , wherein the traces are made of an electrically conductive material.
5. The wireless power transfer system of claim 1 , wherein the first layer of the PCB is connected to the second layer of the PCB through thermal vias.
6. The wireless power transfer system of claim 2 , further comprising a fan configured to generate cooling air that passes through an air channel, wherein the air channel extends through an inlet path of the transmitter coil, the apertures of the first PCB and the apertures of the second PCB, over an interface surface of the wireless power transmitter, and to an exit path of the transmitter coil.
7. The wireless power transfer system of claim 6 , wherein the interface surface of the wireless power receiver is in contact with the air channel to cool the receiver coil through thermal conductivity between the first layer of the PCB and the second layer of the PCB.
8. The wireless power transfer system of claim 1 , wherein the transmitter electric field shield is disposed at an interface surface of the wireless power transmitter.
9. The wireless power transfer system of claim 1 , wherein the receiver electric field shield is disposed at the interface surface of the wireless power receiver.