Semiconductor device package assemblies with direct leadframe attachment
In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive.
1. A semiconductor device package comprising:
a substrate;
a semiconductor die disposed on and coupled with the substrate, the semiconductor die being made of silicon carbide; and
a leadframe including a planar body having an indentation disposed therein, the indentation defining a recess in the planar body, the recess defining an opening in the planar body, the opening having a continuous perimeter, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive,
the indentation including:
a first tab having a first contact surface coupled with the semiconductor die; and
a second tab having a second contact surface coupled with the semiconductor die.
2. The semiconductor device package of claim 1 , wherein:
the indentation is defined in a body of the leadframe, the body of the leadframe being arranged in a first plane; and
the first contact surface and the second contact surface being arranged in a second plane,
the second plane being parallel with, and non-coplanar with the first plane.
3. The semiconductor device package of claim 2 , wherein the first tab includes a sloped portion that is disposed between the body of the leadframe and the first contact surface, the sloped portion being sloped with respect to the first plane and the second plane.
4. The semiconductor device package of claim 1 , wherein the first tab and the second tab define a gap between the first contact surface and the second contact surface.
5. The semiconductor device package of claim 1 , wherein the leadframe includes a plurality of buffer legs, the plurality of buffer legs being configured to provide mechanical stops with the substrate to define:
a spacing between the indentation and the semiconductor die; and
a bond line thickness of solder coupling the indentation with the semiconductor die.
6. The semiconductor device package of claim 5 , wherein the plurality of buffer legs are configured to mechanically contact a surface of the substrate to define the spacing and the bond line thickness, the semiconductor die being coupled with the surface of the substrate.
7. The semiconductor device package of claim 6 , wherein the plurality of buffer legs are mechanically independent from the surface of the substrate.
8. The semiconductor device package of claim 1 , wherein the conductive adhesive is a solder material.
9. The semiconductor device package of claim 1 , wherein the substrate is a direct-bonded-metal substrate.
10. The semiconductor device package of claim 1 , wherein the semiconductor die includes a power transistor.
11. A semiconductor device package comprising:
a substrate;
a first semiconductor die disposed on and coupled with the substrate, the first semiconductor die being made of silicon carbide;
a second semiconductor die disposed on and coupled with the substrate, the second semiconductor die being made of silicon carbide;
a leadframe including:
a first leadframe portion including a first planar body having a first indentation disposed therein, the first indentation defining a recess that is wholly disposed within an interior of the first planar body, a contact surface of the first indentation being disposed on and coupled with the first semiconductor die; and
a second leadframe portion including a second planar body having a second indentation disposed therein, the second indentation defining a recess that is wholly disposed within an interior of the second planar body, a contact surface of the second indentation being disposed on and coupled with the second semiconductor die; and conductive adhesive that:
couples the contact surface of the first indentation with the first semiconductor die; and
couples the contact surface of the second indentation with the second semiconductor die,
the contact surface of the first indentation includes a first contact surface and a second contact surface, the first indentation including:
a first tab including the first contact surface, the first tab being coupled with the first semiconductor die; and
a second tab having the second contact surface, the second tab being coupled with the first semiconductor die.
12. The semiconductor device package of claim 11 , wherein:
the first semiconductor die includes a first power transistor; and
the second semiconductor die includes a second power transistor.
13. The semiconductor device package of claim 11 , further comprising:
a third semiconductor die disposed on and coupled with the substrate;
a fourth semiconductor die disposed on and coupled with the substrate;
the first leadframe portion having a third indentation defined therein, a contact surface of the third indentation being disposed on and coupled with the third semiconductor die; and
the second leadframe portion having a fourth indentation defined therein, a contact surface of the fourth indentation being disposed on and coupled with the fourth semiconductor die.
14. The semiconductor device package of claim 13 , wherein the contact surface of the third indentation is coupled with the third semiconductor die and the contact surface of the fourth indentation is coupled with the fourth semiconductor die via the conductive adhesive.
15. The semiconductor device package of claim 13 , wherein:
the first semiconductor die includes a first power transistor;
the second semiconductor die includes a second power transistor;
the third semiconductor die includes a first diode; and
the fourth semiconductor die includes a second diode.
16. The semiconductor device package of claim 11 , wherein the first tab and the second tab define a gap between the first contact surface and the second contact surface.
17. The semiconductor device package of claim 11 , wherein:
the first indentation is defined in a body of the first leadframe portion, the body of the first leadframe portion being arranged in a first plane; and
the contact surface of the first indentation being arranged in a second plane,
the second plane being parallel with, and non-coplanar with the first plane.
18. The semiconductor device package of claim 17 , wherein the first indentation includes a sloped portion that is disposed between the body of the first leadframe portion and the contact surface of the first indentation, the sloped portion being sloped with respect to the first plane and the second plane.
19. The semiconductor device package of claim 11 , wherein the leadframe includes a plurality of buffer legs, the plurality of buffer legs being configured to provide mechanical stops with the substrate to define:
a spacing between the first indentation and the first semiconductor die;
a bond line thickness of the conductive adhesive coupling the first indentation with the first semiconductor die;
a spacing between the second indentation and the second semiconductor die; and
a bond line thickness of the conductive adhesive coupling the second indentation with the second semiconductor die,
the first leadframe portion including at least one buffer leg, and the second leadframe portion including at least one buffer leg.