THERMALLY PROCESSIBLE PIEZOELECTRIC COMPOSITIONS CONTAINING A THERMAL CROSSLINKING AGENT AND METHODS ASSOCIATED THEREWITH

1 . A composition comprising:

a plurality of piezoelectric particles dispersed in at least a portion of a polymer material comprising at least one thermoplastic polymer; and

at least one thermal crosslinking agent dispersed in at least a portion of the polymer material;

wherein the composition is melt processible at a melt processing temperature that is at or above a melting point or softening temperature of the at least one thermoplastic polymer for a melt processing time that retains at least a majority of the at least one thermal crosslinking in a non-crosslinked state.

2 . The composition of claim 1 , wherein the melt processing temperature is at or above a minimum crosslinking temperature of the at least one thermal crosslinking agent.

3 . The composition of claim 1 , wherein at least a portion of the at least one thermal crosslinking agent is a) covalently bonded to at least a portion of the polymer material, b) covalently bonded to at least a portion of the piezoelectric particles, or c) any combination thereof.

4 . The composition of claim 1 , wherein at least a portion of the at least one thermal crosslinking agent is not covalently bonded to the polymer material, the piezoelectric particles, or any combination thereof.

5 . The composition of claim 1 , wherein the at least one thermal crosslinking agent comprises a first thermal crosslinker comprising an arylacetylene having a reactive functional group, and an optional second thermal crosslinker comprising a diarylacetylene;

wherein the reactive functional group is reactive with a complementary functional group upon the piezoelectric particles, the at least one thermoplastic polymer, or any combination thereof.

6 . The composition of claim 5 , wherein the first thermal crosslinker comprises an arylacetylene cyclic anhydride.

7 . The composition of claim 6 , wherein the polymer material comprises at least one amine-containing polymer, and at least a portion of the first thermal crosslinker is covalently bonded to an amine group of the at least one amine-containing polymer.

8 . The composition of claim 7 , wherein the at least one amine-containing polymer comprises at least one polyamide.

9 . The composition of claim 6 , wherein the piezoelectric particles comprise amine-functionalized piezoelectric particles, and at least a portion of the first thermal crosslinker is covalently bonded to an amine group of the amine-functionalized piezoelectric particles.

10 . The composition of claim 5 , wherein the second thermal crosslinker is present.

11 . The composition of claim 5 , wherein the first thermal crosslinker is covalently bonded to at least a portion of the polymer material, at least a portion of the piezoelectric particles, or any combination thereof.

12 . The composition of claim 1 , wherein the polymer material, the piezoelectric particles, and the at least one thermal crosslinking agent collectively define a composite filament.

13 . An additive manufacturing process comprising:

providing the composition of claim 1 ;

depositing the composition layer-by-layer to form a printed part; and

after depositing the composition layer-by-layer, heating the composition at a curing temperature that is at or above a minimum crosslinking temperature of the at least one thermal crosslinking agent for a time sufficient to crosslink or increase an extent of crosslinking of the at least one thermal crosslinking agent to form an at least partially cured printed part.

14 . The additive manufacturing process of claim 13 , wherein the time is about 6 hours or greater, the curing temperature is about 200° C. or greater, or any combination thereof.

15 . The additive manufacturing process of claim 13 , wherein the at least one thermal crosslinking agent comprises a first thermal crosslinker comprising an arylacetylene having a reactive functional group, and a second thermal crosslinker comprising a diarylacetylene;

wherein the reactive functional group is reactive with a complementary functional group upon the piezoelectric particles, the at least one thermoplastic polymer, or any combination thereof.

16 . The additive manufacturing process of claim 15 , wherein at least a portion of the first thermal crosslinker is covalently bonded to at least a portion of the polymer material, at least a portion of the piezoelectric particles, or any combination thereof.

17 . The additive manufacturing process of claim 13 , further comprising:

poling at least a portion of the at least partially cured printed part.

18 . The additive manufacturing process of claim 13 , wherein the polymer material, the piezoelectric particles, and the at least one thermal crosslinking agent collectively define a composite filament, and the printed part is formed by a fused filament fabrication process.

19 . A printed part comprising the composition of claim 1 , wherein the composition is printed at or above the melting processing temperature of the at least one thermoplastic polymer.

20 . A printed part comprising:

a plurality of piezoelectric particles dispersed in at least a portion of a polymer material comprising at least one thermoplastic polymer; and

at least one thermal crosslinking agent dispersed in a crosslinked state in at least a portion of the polymer material;

wherein the at least one thermal crosslinking agent comprises a first thermal crosslinker comprising an arylacetylene having a reactive functional group and a second thermal crosslinker comprising a diarylacetylene;

wherein the reactive functional group is reactive with a complementary functional group upon the piezoelectric particles, the polymer material, or any combination thereof.