IP Library Granted Patent US 12,405,323
Granted Patent B2
US 12,405,323 · App. 18/545,847 · Granted Sep 2, 2025

Magnetic sensor half-bridge based on inverse spin hall effect with reduced thermal drift

Inventors: Quang Le (San Jose, CA); Xiaoyong Liu (San Jose, CA); Hisashi Takano (Fujisawa, JP); Brian R. York (San Jose, CA)
Assignee: Western Digital Technologies, Inc.
G01R33/07
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,405,323
App. No.
18/545,847
Granted
Sep 2, 2025
Kind
B2
Abstract

The present disclosure generally relates to a magnetic sensor half bridge circuit. The half bridge circuit comprises a bias source connected to a first leg and a second leg. The first leg comprises one or more first spin-orbit torque (SOT) structures connected in series, each first SOT structure comprising a first ferromagnetic (FM) layer disposed on a first SOT layer. The first SOT layer has a first end connected to ground and a second end connected to a first voltage sensor. The second leg comprises one or more second SOT structures connected in series, each second SOT structure comprising a second FM layer disposed on a second SOT layer. The second SOT layer has a first end connected to a second voltage sensor and a second end connected to a ground. The first voltage sensor is disposed adjacent to the second voltage sensor.

Claims (72)

1. A half bridge circuit, comprising:

a first spin-orbit torque (SOT) layer having a first end and a second end opposite the first end;

a first ferromagnetic (FM) layer disposed on the first SOT layer;

a first ground connected to the first end of the first SOT layer;

a first voltage sensor connected to the second end of the first SOT layer;

a bias source connected to the first FM layer;

a second SOT layer having a first end and a second end opposite the first end;

a second FM layer disposed on the second SOT layer, the second FM layer being connected to the bias source;

a second ground connected to the second end of the second SOT layer; and

a second voltage sensor connected to the first end of the second SOT layer.

2. The half bridge circuit of claim 1 , wherein the first voltage sensor is disposed adjacent to the second voltage sensor.

3. The half bridge circuit of claim 1 , wherein a ratio of a width of the first FM layer to a height of the first FM layer is greater than or equal to 3, and wherein a ratio of a width of the second FM layer to a height of the second FM layer is greater than or equal to 3.

4. The half bridge circuit of claim 1 , further comprising:

a first biasing layer disposed adjacent to the first FM layer over the first end of the first SOT layer;

a second biasing layer disposed adjacent to the first FM layer over the second end of the first SOT layer;

a third biasing layer disposed adjacent to the second FM layer over the first end of the second SOT layer; and

a fourth biasing layer disposed adjacent to the second FM layer over the second end of the second SOT layer.

5. The half bridge circuit of claim 1 , further comprising:

a third FM layer disposed below the first SOT layer; and

a fourth FM layer disposed below the second SOT layer.

6. The half bridge circuit of claim 1 , wherein the first FM layer and the second FM layer are each individually rectangular or elliptical in shape.

7. A magnetic sensor comprising the half bridge circuit of claim 1 .

8. A half bridge circuit, comprising:

a bias source;

a first leg connected to the bias source, the first leg comprising one or more first spin-orbit torque (SOT) structures, each first SOT structure comprising:

a first SOT layer having a first end and a second end opposite the first end;

a first ferromagnetic (FM) layer disposed on the first SOT layer;

a first ground connected to the first end of the first SOT layer; and

a first voltage sensor connected to the second end of the first SOT layer; and

a second leg connected to the bias source, the second leg comprising one or more second SOT structures, each second SOT structure comprising:

a second SOT layer having a first end and a second end opposite the first end;

a second FM layer disposed on the second SOT layer;

a second ground connected to the second end of the second SOT layer; and

a second voltage sensor connected to the first end of the second SOT layer.

9. The half bridge circuit of claim 8 , wherein the first leg comprises a plurality of first SOT structures connected in series, and the second leg comprises a plurality of second SOT structures connected in series.

10. The half bridge circuit of claim 8 , wherein the bias source is connected to the first FM layer and to the second FM layer.

11. The half bridge circuit of claim 8 , wherein the first SOT layer and the second SOT layer each individually comprises BiSb or YPtSb.

12. The half bridge circuit of claim 8 , wherein the second end of the first SOT layer is disposed adjacent to the first end of the second SOT layer.

13. The half bridge circuit of claim 8 , wherein the first FM layer is disposed between a first biasing layer and a second biasing layer, and wherein the second FM layer is disposed between a third biasing layer and a fourth biasing layer.

14. A magnetic sensor comprising the half bridge circuit of claim 8 .

15. A half bridge circuit, comprising:

a bias source;

a first leg connected to the bias source, the first leg comprising one or more first spin-orbit torque (SOT) structures connected in series, each first SOT structure comprising:

a first SOT layer having a first end and a second end opposite the first end;

a first ferromagnetic (FM) layer disposed on the first SOT layer;

a second FM layer disposed below the first SOT layer;

a first ground connected to the first end of the first SOT layer; and

a first voltage sensor connected to the second end of the first SOT layer; and

a second leg connected to the bias source, the second leg comprising one or more second SOT structures connected in series, each second SOT structure comprising:

a second SOT layer having a first end and a second end opposite the first end, wherein the first end of the second SOT layer is disposed adjacent to the second end of the first SOT layer;

a third FM layer disposed on the second SOT layer;

a fourth FM layer disposed below the second SOT layer;

a second ground connected to the second end of the second SOT layer; and

a second voltage sensor connected to the first end of the second SOT layer.

16. The half bridge circuit of claim 15 , wherein:

a ratio of a width of the first FM layer to a height of the first FM layer is greater than or equal to 3;

a ratio of a width of the second FM layer to a height of the second FM layer is greater than or equal to 3;

a ratio of a width of the third FM layer to a height of the third FM layer is greater than or equal to 3; and

a ratio of a width of the fourth FM layer to a height of the fourth FM layer is greater than or equal to 3.

17. The half bridge circuit of claim 15 , wherein:

the first FM layer is disposed between a first biasing layer and a second biasing layer;

the second FM layer is disposed between a third biasing layer and a fourth biasing layer;

the third FM layer is disposed between a fifth biasing layer and a sixth biasing layer; and

the fourth FM layer is disposed between a seventh biasing layer and an eighth biasing layer.

18. The half bridge circuit of claim 17 , wherein the first, second, third, fourth, fifth, and sixth biasing layers are hard biasing layer.

19. The half bridge circuit of claim 17 , wherein the first, second, third, fourth, fifth, and sixth biasing layers are soft biasing layer.

20. The half bridge circuit of claim 15 , wherein:

a width of the first FM layer is greater than a height of the first FM layer;

a width of the second FM layer is greater than a height of the second FM layer;

a width of the third FM layer is greater than a height of the third FM layer; and

a width of the fourth FM layer is greater than a height of the fourth FM layer.

21. A magnetic sensor comprising the half bridge circuit of claim 15 .

Assignments (3)
PATENT COLLATERAL AGREEMENT (DDTL) Recorded Feb 22, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 066648/0206 →
PATENT COLLATERAL AGREEMENT (AR) Recorded Feb 22, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 066648/0284 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2024
From: LE, QUANG; LIU, XIAOYONG; TAKANO, HISASHI; YORK, BRIAN R.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 066420/0164 →
Continuity (1)
Related Publication 20250199093A1 · Jun 19, 2025
References Cited (21)
US 6771472B1 · Mao · 2004 [cited by examiner]
US 9285439B2 · Motz et al. · 2016 [cited by applicant]
US 10663535B2 · Motz · 2020 [cited by applicant]
US 11204374B2 · Kishi et al. · 2021 [cited by applicant]
US 20170092345A1 · Fukuzawa · 2017 [cited by applicant]
US 20170222137A1 · Raberg · 2017 [cited by applicant]
US 20190377037A1 · Wu et al. · 2019 [cited by applicant]
US 20200082858A1 · Kim · 2020 [cited by examiner]
US 20200365652A1 · Hong · 2020 [cited by examiner]
US 20210063506A1 · Wang · 2021 [cited by examiner]
US 20230204692A1 · Kwon et al. · 2023 [cited by applicant]
US 20230284538A1 · Debashis · 2023 [cited by examiner]
US 20230358826A1 · Sousa et al. · 2023 [cited by applicant]
CN 112082579A · 2020 [cited by applicant]
DE 102010018874A1 · 2011 [cited by applicant]
EP 3006951A1 · 2016 [cited by applicant]
KR 20180090459A · 2018 [cited by applicant]
WO 2012136132A1 · 2012 [cited by applicant]
WO 2013097542A1 · 2013 [cited by applicant]
Luo, Keliu et al., “Implementation of a full Wheatstone-bridge GMR sensor by utilizing spin-orbit torque induced magnetizationswitching in synthetic antiferromagneticlayer”, Journal of Applied Physics, 2023, <https://do… [cited by applicant]
International Search Report and Written Opinion for Application No. PCT/US2024/040848 dated Nov. 12, 2024. [cited by applicant]