IP Library Granted Patent US 12,356,132
Granted Patent B2
US 12,356,132 · App. 18/640,588 · Granted Jul 8, 2025

Open-ear headphone

Inventors: Joel Miller (Westborough, MA); Todd Reily (North Reading, MA)
Assignee: Bose Corporation
H04R1/1016H04R1/08H04R1/1025H04R5/027
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,356,132
App. No.
18/640,588
Granted
Jul 8, 2025
Kind
B2
Abstract

An open-ear headphone includes an acoustic module, a battery housing, and a body coupled to the acoustic module. The acoustic module includes a portion that is configured to sit in a cavum conchae of an outer ear of a user, an acoustic transducer, and a first sound-emitting opening that is configured to emit sound produced by the acoustic transducer. The battery housing is configured to be located behind the outer ear and contains a battery power source. The body is coupled to the acoustic module and includes a first portion that is configured to pass over an outer side of at least one of an anti-helix and a helix and a lobule of the outer ear, and a second portion comprising the battery housing.

Claims (24)

1. An open-ear headphone, comprising:

an acoustic module comprising: a portion that is configured to sit in a cavum conchae of an outer ear of a user, an acoustic transducer, and a first sound-emitting opening that is configured to emit sound produced by the acoustic transducer;

a battery housing configured to be located behind the outer ear and containing a battery power source; and

a body coupled to the acoustic module and comprising a first portion configured to pass over an outer side of at least one of an anti-helix, a helix, or a lobule of the outer ear, and a second portion comprising the battery housing.

2. The open-ear headphone of claim 1 , wherein the first sound-emitting opening is configured to be spaced from and proximate a user's ear canal opening.

3. The open ear headphone of claim 1 , wherein the body further comprises a connecting portion coupling the battery housing to the first portion.

4. The open-ear headphone of claim 1 , wherein the acoustic module and body together are generally “C”-shaped.

5. The open-ear headphone of claim 3 , wherein the connecting portion is disposed between the first portion of the body and the battery housing.

6. The open-ear headphone of claim 1 , wherein the acoustic module and the body are parts of a unitary molded plastic housing.

7. The open-ear headphone of claim 1 , wherein the acoustic module has a lower portion that is outwardly convex and is configured to sit in a concavity of a user's cavum conchae.

8. The open-ear headphone of claim 3 , wherein the connecting portion is complaint and enables displacement of the battery housing relative to the acoustic module.

9. The open-ear headphone of claim 8 , wherein the connecting portion is formed of an elastomer.

10. The open-ear headphone of claim 1 , further comprising one or more external microphones.

11. The open-ear headphone of claim 10 , wherein the one or more external microphones are configured as feed-forward microphones of an active noise cancelation system.

12. The open-ear headphone of claim 10 , wherein the one or more external microphones comprise a plurality of microphones which are beam-formed.

13. The open-ear headphone of claim 1 , wherein a center of gravity of the open-ear headphone is between the acoustic module and the body.

14. The open-ear headphone of claim 13 , wherein the center of gravity is configured to lie within the outer ear when the open-ear headphone is worn.

15. The open-ear headphone of claim 1 , wherein a center of gravity of the open-ear headphone is between the acoustic module and the body.

16. The open-ear headphone of claim 1 , further comprising a printed circuit board in the first portion of the body and that is electrically coupled to the battery.

17. The open-ear headphone of claim 16 , further comprising a flexible circuit element that electrically couples the printed circuit board to the acoustic transducer.

18. The open-ear headphone of claim 3 , wherein the connecting portion is configured to pass over an outer edge of a user's outer ear at a location of one or more of a helix, an anti-helix, and a lobule.

19. The open-ear headphone of claim 1 , further comprising a user interface element built into the body.

20. The open-ear headphone of claim 1 , wherein the acoustic module further comprises a second sound-emitting opening that is configured to be farther from the user's ear canal opening than is the first sound-emitting opening.

21. The open-ear headphone of claim 20 , wherein the first and second sound-emitting openings are arranged to accomplish a dipole-like acoustic pattern.

Assignments (1)
SECURITY INTEREST Recorded Feb 28, 2025
From: BOSE CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 070438/0001 →
Continuity (4)
Continuation 18137007 · Apr 20, 2023
Continuation 17474987 · Sep 14, 2021
Continuation 17306208 · May 3, 2021
Related Publication 20240267665A1 · Aug 8, 2024
References Cited (151)
US 4932052A · Lo · 1990 [cited by applicant]
US 4972468A · Murase · 1990 [cited by applicant]
US 5204917A · Arndt · 1993 [cited by applicant]
US 5323468A · Bottesch · 1994 [cited by applicant]
US 5729615A · Yang · 1998 [cited by applicant]
US 6115620A · Colonna · 2000 [cited by applicant]
US 6449374B1 · Skulley · 2002 [cited by applicant]
US 6456720B1 · Brimhall · 2002 [cited by applicant]
US 6600825B1 · Leysieffer · 2003 [cited by applicant]
US 6721433B2 · Sato · 2004 [cited by applicant]
US 6804364B1 · De Jonge · 2004 [cited by applicant]
US 7648005B2 · Leong · 2010 [cited by applicant]
US 7841446B2 · Leong · 2010 [cited by applicant]
US 8111854B2 · Peng · 2012 [cited by applicant]
US 8218799B2 · Murphy · 2012 [cited by applicant]
US 8411893B2 · Ito · 2013 [cited by applicant]
US 8457336B2 · Ladabaum · 2013 [cited by applicant]
US 8798305B2 · Harper · 2014 [cited by applicant]
US 8885861B2 · Beck · 2014 [cited by examiner]
US 9118990B2 · Hankey · 2015 [cited by applicant]
US 9591393B2 · Feeley · 2017 [cited by applicant]
US 9675259B2 · Lee · 2017 [cited by applicant]
US 9716937B2 · Qian · 2017 [cited by applicant]
US 9900680B2 · Milam · 2018 [cited by applicant]
US 9980075B1 · Benattar · 2018 [cited by applicant]
US 10063958B2 · Jentz · 2018 [cited by examiner]
US 10149037B1 · Chen · 2018 [cited by applicant]
US 10516928B2 · Briggs · 2019 [cited by applicant]
US 10582284B2 · Trainer · 2020 [cited by applicant]
US 10602258B2 · Khaleghimeybodi · 2020 [cited by applicant]
US 10674244B2 · Dominijanni · 2020 [cited by applicant]
US 10757491B1 · Jackson · 2020 [cited by applicant]
US 10827246B1 · Oommen · 2020 [cited by applicant]
US 10924838B1 · Graff · 2021 [cited by applicant]
US 11140469B1 · Miller · 2021 [cited by applicant]
US 11187288B2 · Vyletel · 2021 [cited by applicant]
US 11303984B2 · Dominijanni · 2022 [cited by applicant]
US 20030147545A1 · Wagner · 2003 [cited by applicant]
US 20030152244A1 · Dobras · 2003 [cited by applicant]
US 20040055811A1 · Shih · 2004 [cited by applicant]
US 20040170294A1 · Murozaki · 2004 [cited by applicant]
US 20050078847A1 · Dobras · 2005 [cited by applicant]
US 20050157899A1 · Raviv · 2005 [cited by applicant]
US 20070021804A1 · Maltan · 2007 [cited by applicant]
US 20070177749A1 · Sjursen · 2007 [cited by applicant]
US 20070217643A1 · Chang · 2007 [cited by applicant]
US 20070258613A1 · Wright · 2007 [cited by applicant]
US 20080019554A1 · Krywko · 2008 [cited by applicant]
US 20080132292A1 · Hansen · 2008 [cited by applicant]
US 20080152183A1 · Janik · 2008 [cited by applicant]
US 20090052702A1 · Murphy · 2009 [cited by applicant]
US 20090067658A1 · Lin · 2009 [cited by applicant]
US 20090110227A1 · Prince · 2009 [cited by applicant]
US 20090116678A1 · Bevirt · 2009 [cited by applicant]
US 20090123000A1 · Wright · 2009 [cited by applicant]
US 20090202098A1 · Chan · 2009 [cited by applicant]
US 20090238398A1 · Connors · 2009 [cited by examiner]
US 20100027824A1 · Atamaniuk · 2010 [cited by applicant]
US 20100202643A1 · Nielsen · 2010 [cited by applicant]
US 20100210939A1 · Hartmann · 2010 [cited by applicant]
US 20110086677A1 · Jensen · 2011 [cited by applicant]
US 20120039501A1 · Silvestri · 2012 [cited by applicant]
US 20120134524A1 · Peng · 2012 [cited by applicant]
US 20120140976A1 · Birger · 2012 [cited by applicant]
US 20120163617A1 · Silvestri · 2012 [cited by applicant]
US 20130089229A1 · Kristo · 2013 [cited by applicant]
US 20130107126A1 · Nonomura · 2013 [cited by applicant]
US 20130136279A1 · Brown · 2013 [cited by applicant]
US 20130142376A1 · Lin · 2013 [cited by applicant]
US 20130216087A1 · MacDonald · 2013 [cited by applicant]
US 20130336514A1 · Kelly · 2013 [cited by applicant]
US 20130343594A1 · Howes · 2013 [cited by applicant]
US 20140205125A1 · Triato · 2014 [cited by applicant]
US 20140254842A1 · Smith · 2014 [cited by applicant]
US 20140270317A1 · Burgett · 2014 [cited by applicant]
US 20140323183A1 · Klein · 2014 [cited by applicant]
US 20140334661A1 · Besgen, Sr. · 2014 [cited by applicant]
US 20150063622A1 · Wallace · 2015 [cited by applicant]
US 20150071477A1 · Mainini · 2015 [cited by applicant]
US 20150078600A1 · Rasmussen · 2015 [cited by applicant]
US 20150172802A1 · Takeno · 2015 [cited by applicant]
US 20150289364A1 · Ilkko · 2015 [cited by applicant]
US 20150296285A1 · Proos · 2015 [cited by applicant]
US 20150358790A1 · Nasserbakht · 2015 [cited by applicant]
US 20160020500A1 · Matsuda · 2016 [cited by applicant]
US 20160050477A1 · Ushakov · 2016 [cited by applicant]
US 20160073192A1 · Briggs · 2016 [cited by applicant]
US 20160100237A1 · Blouse · 2016 [cited by applicant]
US 20160134957A1 · Jentz · 2016 [cited by applicant]
US 20160134958A1 · Thompson · 2016 [cited by applicant]
US 20160261942A1 · Hayden · 2016 [cited by applicant]
US 20160360307A1 · Willis · 2016 [cited by applicant]
US 20170034611A1 · Maruyama · 2017 [cited by applicant]
US 20170041701A1 · Cheng · 2017 [cited by applicant]
US 20170064427A1 · Rich · 2017 [cited by applicant]
US 20170094384A1 · Trainer · 2017 [cited by applicant]
US 20170099537A1 · Ushakov · 2017 [cited by applicant]
US 20170105062A1 · Lamb · 2017 [cited by applicant]
US 20170280220A1 · Poulsen · 2017 [cited by applicant]
US 20170281416A1 · O'Leary · 2017 [cited by applicant]
US 20170303027A1 · Barry · 2017 [cited by applicant]
US 20170311067A1 · Willis · 2017 [cited by applicant]
US 20170311070A1 · Igarashi · 2017 [cited by applicant]
US 20170359644A1 · Cramer · 2017 [cited by applicant]
US 20180070165A1 · Hatfield · 2018 [cited by applicant]
US 20180070179A1 · McAuliffe · 2018 [cited by applicant]
US 20180077478A1 · Willis · 2018 [cited by applicant]
US 20180109868A1 · Roed · 2018 [cited by applicant]
US 20180146279A1 · Wang · 2018 [cited by applicant]
US 20180160208A1 · Lee · 2018 [cited by applicant]
US 20180213315A1 · Kirkpatrick · 2018 [cited by applicant]
US 20180288518A1 · Schmidt · 2018 [cited by applicant]
US 20190014403A1 · Lee · 2019 [cited by applicant]
US 20190033505A1 · Cross · 2019 [cited by applicant]
US 20190052949A1 · Igarashi · 2019 [cited by applicant]
US 20190069064A1 · Ott · 2019 [cited by applicant]
US 20190069104A1 · Lindberg · 2019 [cited by applicant]
US 20190141428A1 · Gampe · 2019 [cited by applicant]
US 20190223747A1 · Chou · 2019 [cited by applicant]
US 20190261077A1 · Dominijanni · 2019 [cited by applicant]
US 20200037077A1 · Peterson · 2020 [cited by applicant]
US 20200267464A1 · Graff · 2020 [cited by applicant]
US 20200280783A1 · Dominijanni · 2020 [cited by applicant]
US 20210067857A1 · Struzik · 2021 [cited by applicant]
US 20210067862A1 · Li · 2021 [cited by applicant]
US 20210076118A1 · Struzik · 2021 [cited by applicant]
US 20210241782A1 · Ganeshkumar · 2021 [cited by applicant]
US 20210345036A1 · Van Hook · 2021 [cited by applicant]
US 20220014833A1 · Lee · 2022 [cited by applicant]
US 20220086552A1 · Dominijanni · 2022 [cited by applicant]
US 20220174388A1 · Dominijanni · 2022 [cited by applicant]
US 20220191607A1 · Lee · 2022 [cited by applicant]
US 20230028541A1 · Wang · 2023 [cited by applicant]
US 20230308801A1 · Schmidt · 2023 [cited by applicant]
CN 107113486A · 2017 [cited by applicant]
CN 207652640U · 2018 [cited by applicant]
CN 209659534U · 2019 [cited by applicant]
CN 109417662B · 2021 [cited by applicant]
EP 2802155A1 · 2014 [cited by applicant]
EP 1871141B2 · 2017 [cited by applicant]
EP 2974360B1 · 2019 [cited by applicant]
WO 2010116510W · 2010 [cited by applicant]
WO 2019164553A1 · 2019 [cited by applicant]
Jabra, Jabra Storm User Manual, Jabra Storm, 2014; Model: BTE7; FCC ID: BCE-BTE7; IC: 2386C-BTE7. [cited by applicant]
Sennheiser Communications, VMX 100 3.1 Instruction Manual, SennheiserVMX 100. [cited by applicant]
Tittel, Ed, 34 Cool Back to School Tools, Sennheiser BW900 Bluetooth Wireless Office Headset, Aug. 27, 2007; last downloaded from the internet on Jun. 6, 2018; https://www.tomsguide.com/us/cool-back-to-school-tools,revi… [cited by applicant]
Unpublished U.S. Appl. No. 15/375,119 filed on Dec. 11, 2016 entitled Acoustic Transducer; Applicant: Bose Corporation. [cited by applicant]
Unpublished U.S. Appl. No. 15/647,749, filed Jul. 12, 2017 entitled Audio Device; Applicant: Bose Corporation. [cited by applicant]
Japanese Notice of Allowance dated Apr. 1, 2025 for Japanese Patent Application No. 2023-568086. [cited by applicant]
First Office Action dated Dec. 16, 2024 for Japanese Patent Application No. 2023-568086. [cited by applicant]
International Search Report and Written Opinion International application No. PCT/US2022/027367. [cited by applicant]