POLYMER PATTERNED DISK STACK MANUFACTURING

1 . A system comprising:

a first chuck operable to support a stencil including a plurality of apertures;

a wafer chuck operable to support and move a wafer including a plurality of incoupling gratings;

a first light source operable to direct light to impinge on a first surface of the stencil;

one or more second light sources operable to direct light to impinge on the wafer;

one or more lens and camera assemblies operable to:

receive light from the first light source passing through the plurality of apertures in the stencil; and

receive light from the one or more second light sources diffracted from the plurality of incoupling gratings in the wafer; and

an alignment system operable to move the wafer with respect to the stencil in order to reduce an offset between aperture locations and incoupling grating locations.

2 . The system of claim 1 wherein the one or more lens and camera assemblies comprises:

a first camera operable to detect an aperture position of a first aperture of the plurality of apertures; and

a second camera operable to detect an aperture position of a second aperture of the plurality of apertures.

3 . The system of claim 1 wherein the one or more lens and camera assemblies comprises a single camera operable to detect an aperture position of a first aperture of the plurality of apertures and an aperture position of a second aperture of the plurality of apertures.

4 . The system of claim 1 wherein the light from the one or more second light sources diffracted from the incoupling gratings in the wafer propagates by total internal reflection prior to being diffracted out of the wafer from the incoupling gratings.

5 . The system of claim 1 wherein moving the wafer with respect to the stencil comprises:

rotating and translating the wafer; and

thereafter, bringing the wafer into contact with the stencil.

6 . The system of claim 1 wherein the first light source and the one or more second light sources are positioned on opposing sides of the wafer.

7 . The system of claim 1 wherein the wafer is disposed in a lateral plane and includes at least two eyepiece waveguides and the plurality of incoupling gratings includes a first incoupling grating and a second incoupling grating, and wherein a first eyepiece waveguide comprises a first diffraction pattern and the first incoupling grating and a second eyepiece waveguide comprises a second diffraction pattern and the second incoupling grating.

8 . The system of claim 7 , wherein the first incoupling grating is disposed in the lateral plane at a first lateral position and the first diffraction pattern is disposed in the lateral plane at a second lateral position laterally offset from the first lateral position, and wherein the second incoupling grating is disposed in the lateral plane at a third lateral position and the second diffraction pattern is disposed in the lateral plane at a fourth lateral position laterally offset from the third lateral position.

9 . An assembly system comprising:

a wafer casting station;

a stencil placement station;

a deposition station;

a stencil separation station;

a first inspection station;

a layer assembly station; and

a second inspection station.

10 . The assembly system of claim 9 wherein the stencil placement station comprises:

a first chuck operable to support a stencil including a plurality of apertures;

a wafer chuck operable to support and move a wafer including a plurality of incoupling gratings;

a first light source operable to direct light to impinge on a first surface of the stencil;

one or more second light sources operable to direct light to impinge on the wafer;

one or more lens and camera assemblies operable to:

receive light from the first light source passing through the plurality of apertures in the stencil; and

receive light from the one or more second light sources diffracted from the plurality of incoupling gratings in the wafer; and

an alignment system operable to move the wafer with respect to the stencil in order to reduce an offset between aperture locations and incoupling grating locations.

11 . The assembly system of claim 10 wherein the one or more lens and camera assemblies comprises:

a first camera operable to detect an aperture position of a first aperture of the plurality of apertures; and

a second camera operable to detect an aperture position of a second aperture of the plurality of apertures.

12 . The assembly system of claim 10 wherein the one or more lens and camera assemblies comprises a single camera operable to detect an aperture position of a first aperture of the plurality of apertures and an aperture position of a second aperture of the plurality of apertures.

13 . The assembly system of claim 10 wherein the light from the one or more second light sources diffracted from the incoupling gratings in the wafer propagates by total internal reflection prior to being diffracted out of the wafer from the incoupling gratings.

14 . The assembly system of claim 10 wherein moving the wafer with respect to the stencil comprises:

rotating and translating the wafer; and

thereafter, bringing the wafer into contact with the stencil.

15 . The assembly system of claim 10 wherein the wafer is disposed in a lateral plane and includes at least two eyepiece waveguides and the plurality of incoupling gratings includes a first incoupling grating and a second incoupling grating, and wherein a first eyepiece waveguide comprises a first diffraction pattern and the first incoupling grating and a second eyepiece waveguide comprises a second diffraction pattern and the second incoupling grating.

16 . The assembly system of claim 15 , wherein the first incoupling grating is disposed in the lateral plane at a first lateral position and the first diffraction pattern is disposed in the lateral plane at a second lateral position laterally offset from the first lateral position, and wherein the second incoupling grating is disposed in the lateral plane at a third lateral position and the second diffraction pattern is disposed in the lateral plane at a fourth lateral position laterally offset from the third lateral position.