SYSTEM AND METHOD FOR REPAIRING VACANCIES RESULTING FROM MASS TRANSFER OF DEVICES
Data representations are formed of a target substrate and a plurality of donor coupons that are incompletely filled with functional chips. The data representations are abstracted into a current state description of the target substrate and the donor coupons and input into a machine learning model that has been trained on previous mass transfer sequences. An optimal output of the machine learning model defines at least a selected one or more of the donor coupons and corresponding functional chips of the selected one or more of the donor coupons used to fill the vacancies. A parallel transfer of the corresponding functional chips is performed to fill the vacancies on the target substrate using the selected one or more of the donor coupons.
1 . A method, comprising:
forming a first data representation of a target substrate comprising an array of chips on a carrier with a plurality of vacancies;
forming a second data representation of a plurality of donor coupons that are incompletely filled with functional chips, the plurality of donor coupons being incompletely filled due to any combination of non-functional chips and missing chips;
abstracting the first and second data representations into a current state description of the target substrate and the donor coupons;
inputting the current state description into a machine learning model that has been trained on previous mass transfer sequences;
determining an optimal output of the machine learning model, the optimal output defining at least a selected one or more of the donor coupons and corresponding functional chips of the selected one or more of the donor coupons used to fill the vacancies; and
performing a parallel transfer of the corresponding functional chips to fill the vacancies on the target substrate using the selected one or more of the donor coupons.
2 . The method of claim 1 , wherein the machine learning model comprises a neural network.
3 . The method of claim 1 , wherein the machine learning model comprises a hidden Markov model.
4 . The method of claim 1 , wherein the machine learning model uses a reinforcement learning framework to determine a next operation to perform based on the current state description.
5 . The method of claim 1 , wherein the machine learning model determines subdivisions of the plurality of vacancies of the target substrate to divide matching of the corresponding functional chips to the vacancies into multiple, smaller problems.
6 . The method of claim 5 , wherein the machine learning model reduces the subdivisions to a minimum size that will still fit all of the vacancies within the subdivision.
7 . The method of claim 1 , wherein the current state description further includes data indicating a highest number of the vacancies that can be repaired in one step.
8 . The method of claim 1 , wherein the current state description further includes cost as a function of a number of steps in the parallel transfer.
9 . The method of claim 1 , wherein the current state description further includes costs of different available tooling.
10 . The method of claim 1 , wherein the machine learning model is trained on simulated mass transfer sequences.
11 . A system comprising:
a mass transfer apparatus comprising a transfer substrate operable to selectably pick up, hold, and release objects from a plurality of donor coupons to a target substrate, wherein the target substrate comprises an array of chips on a carrier with a plurality of vacancies, and wherein the plurality of donor coupons is incompletely filled due to any combination of non-functional chips and missing chips; and
a processor coupled to the mass transfer apparatus and configured to:
form a first data representation of the vacancies of the target substrate;
form a second data representation of functional chips of the plurality of donor coupons;
abstract the first and second data representations into a current state description of the target substrate and the donor coupons;
input the current state description into a machine learning model that has been trained on previous mass transfer sequences;
determine an optimal output of the machine learning model, the optimal output defining at least a selected one or more of the donor coupons and corresponding functional chips of the selected one or more of the donor coupons used to fill the vacancies; and
causing the mass transfer apparatus to perform a parallel transfer of the corresponding functional chips to fill the vacancies on the target substrate using the selected one or more of the donor coupons.
12 . The system of claim 11 , wherein the machine learning model comprises a neural network.
13 . The system of claim 11 , wherein the machine learning model comprises a hidden Markov model.
14 . The system of claim 11 , wherein the machine learning model uses a reinforcement learning framework to determine an optimal step to take based on features of the current state description.
15 . The system of claim 11 , wherein the machine learning model determines subdivisions of the plurality of vacancies of the target substrate to divide matching of the corresponding functional chips to the vacancies into multiple, smaller problems.
16 . The system of claim 15 , wherein the machine learning model reduces the subdivisions to a minimum size that will still fit all of the vacancies within the subdivision.
17 . The system of claim 11 , wherein the current state description further includes data indicating a highest number of the vacancies that can be repaired in one step.
18 . The system of claim 11 , wherein the current state description further includes cost as a function of a number of steps in the parallel transfer.
19 . The system of claim 11 , wherein the current state description further includes costs of different available tooling of the mass transfer apparatus.
20 . The system of claim 11 , wherein the machine learning model is trained on simulated mass transfer sequences.