IP Library Patent Application 18857407
Patent Application
App. No. 18/857,407

HEAT EXCHANGERS

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Quick Facts
Patent No.
US None
App. No.
18/857,407
Abstract

Examples of heat exchanger are described herein. In some examples, a heat exchanger may include a flow channel. In some examples, the heat exchanger may include a lattice structure disposed in the flow channel. In some examples, the heat exchanger may include a pipe structure embedded in the lattice structure. In some examples, an end of the pipe structure is disposed in a target region of the flow channel.

Claims (27)

1 . A heat exchanger, comprising:

a flow channel;

a lattice structure disposed in the flow channel; and

a pipe structure embedded in the lattice structure, wherein an end of the pipe structure is disposed in a target region of the flow channel.

2 . The heat exchanger of claim 1 , wherein the lattice structure is a three-dimensional (3D) lattice.

3 . The heat exchanger of claim 2 , wherein the lattice structure and the pipe structure are 3D printed.

4 . The heat exchanger of claim 1 , further comprising a second pipe structure embedded in the lattice structure, wherein a second end of the second pipe structure is disposed in a second target region of the flow channel.

5 . The heat exchanger of claim 1 , further comprising an inlet, wherein the pipe structure is disposed through the inlet.

6 . The heat exchanger of claim 5 , wherein the inlet is disposed on an opposite side of a wall of the heat exchanger from the target region.

7 . The heat exchanger of claim 1 , further comprising a channel between the lattice structure and an interior wall of the flow channel.

8 . The heat exchanger of claim 1 , wherein the target region corresponds to a heat source location.

9 . The heat exchanger of claim 1 , wherein the pipe structure transects the lattice structure.

10 . A heat exchanger, comprising:

a housing;

an outlet disposed on the housing;

an inlet disposed on the housing;

a pipe extending through the inlet into the housing; and

a three-dimensional (3D) lattice disposed in the housing, wherein the pipe is embedded in the 3D lattice.

11 . The heat exchanger of claim 10 , wherein an end of the pipe is disposed in a target region in the housing.

12 . The heat exchanger of claim 11 , wherein fluid is to pass from the end of the pipe in the target region to absorb heat from the 3D lattice and pass to the outlet.

13 . An apparatus, comprising:

a memory;

a processor in electronic communication with the memory, wherein the processor is to:

control a printhead to print a three-dimensional (3D) lattice structure; and

control the printhead to print a pipe structure transecting the 3D lattice structure, wherein the pipe structure is to conduct fluid to a target region including a portion of the 3D lattice structure.

14 . The apparatus of claim 13 , wherein the 3D lattice structure and the pipe structure are printed concurrently.

15 . The apparatus of claim 13 , wherein the processor is to control the printhead to print a housing around the lattice structure.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2025
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PERIDOT PRINT LLC
Reel/Frame 070187/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2025
From: HUANG, WEI; PON, BEN MINT; ANTHONY, THOMAS CRAIG; IRRINKI, HARISH
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 069912/0200 →