INTERPOSER FOR VERTICALLY MOUNTING A CONNECTOR ON A SUBSTRATE
An interposer includes a number of features that electrically and mechanically support a vertical mounted connector. The interposer includes multiple sets of contacts on a top surface. The contacts are arranged and/or adapted to contact respective pins of the connector when the connector is vertically mounted on the interposer. Each contact in each set of contacts is electrically coupled, using a trace, to a respective pad on the bottom surface of the interposer. The contacts, the traces, and the pads are arranged in a fan-out configuration. The interposer also includes a number of securement features that strengthen a mechanical connection between the connector and the interposer.
1 . An electronic device, comprising:
a substrate;
an interposer electrically coupled to the substrate and comprising:
a plurality of contacts on a first surface, at least two of the plurality of contacts having a first spacing;
a plurality of pads on second surface that is opposite the first surface, at least two of the plurality of pads having a second spacing that is greater than first spacing; and
a plurality of traces, each trace of the plurality of traces extending between a respective contact of the plurality of contacts and a respective pad of the plurality of pads; and
a connector vertically mounted on the interposer and having a plurality of pins, wherein each pin of the plurality of pins is electrically coupled to a respective contact of the plurality of contacts.
2 . The electronic device of claim 1 , wherein the interposer further comprises an alignment aperture defined by the first surface.
3 . The electronic device of claim 2 , wherein the connector further comprises an alignment prong that is received within the alignment aperture when the connector is vertically mounted on the interposer.
4 . The electronic device of claim 1 , wherein the interposer further comprises a securement aperture defined by the first surface.
5 . The electronic device of claim 4 , wherein the connector further comprises a securement prong that is received within the securement aperture when the connector is vertically mounted on the interposer, the securement prong and the securement aperture providing mechanical support for the connector.
6 . The electronic device of claim 1 , wherein the plurality of contacts, the plurality of traces and the plurality of pads are arranged in a fan-out configuration.
7 . The electronic device of claim 1 , wherein the interposer is surface mounted to a substrate configured for a type of connector that is different than the connector that is vertically mounted on the interposer.
8 . The electronic device of claim 1 , further comprising a configurable conductor mechanism integrated with the interposer.
9 . An interposer for vertically mounting a connector to a substrate, comprising:
a first set of contacts on a first surface of the interposer and being oriented in a first direction;
a second set of contacts on the first surface of the interposer and being oriented in a second direction, the first set of pins and the second set of pins adapted to contact respective pins of the connector;
a first set of pads on a second surface of the interposer that is opposite the first surface of the interposer, the first set of pads being electrically coupled to the first set of contacts; and
a second set of pads on the second surface of the interposer, the second set of pads being electrically coupled to the second set of contacts.
10 . The interposer of claim 9 , wherein a first set of traces electrically couple the first set of contacts and the first set of pads and wherein a second set of traces electrically couple the second set of contacts and the second set of pads.
11 . The interposer of claim 9 , wherein the first set of traces and the first set of pads are arranged in a fan-out configuration.
12 . The interposer of claim 9 , further comprising an alignment aperture defined by the first surface.
13 . The interposer of claim 9 , further comprising a securement aperture defined by the first surface.
14 . The interposer of claim 9 , further comprising a configurable connector mechanism integrated with the interposer.
15 . An electronic device, comprising:
a substrate;
a connector support means electrically coupled to the substrate and comprising:
a first set of contact means arranged at a first location on a first surface of the connector support means and having a first spacing;
a second set of contact means arranged at a second location on the first surface of the connector support means and having the first spacing;
a first set of connection means electrically coupled to the first set of contact means, the first set of connection means having a second spacing that is greater than the first spacing; and
a second set of connection means electrically coupled to the second set of contact means, the second set of connection means having the second spacing; and
a connector means vertically mounted on the connector support means and electrically coupled to the first set of contact means and the second set of contact means.
16 . The electronic device of claim 15 , wherein the connector support means further comprises an alignment receiving means.
17 . The electronic device of claim 16 , wherein the connector means further comprises an alignment means that is received within the alignment receiving means.
18 . The electronic device of claim 15 , wherein the connector support means further comprises a securement receiving means.
19 . The electronic device of claim 18 , further comprising a pulldown means integrated with the connector support means.
20 . The electronic device of claim 15 , wherein the first set of contact means, the second set of contact means, the first set of connection means and the second set of connection means are arranged in a fan-out configuration.