JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES

1 . A fluid impingement cooling assembly for at least one semiconductor device, comprising:

a heat exchange base having an inlet chamber and an outlet chamber;

an inlet connection in fluid connection with the inlet chamber;

an outlet connection in fluid connection with the outlet chamber;

a plate coupled to the inlet chamber; and

a first pedestal coupled to the plate and having a first nozzle formed therein, wherein the first pedestal is removable from the plate and interchangeable with a second pedestal having a second nozzle of a different size than the first nozzle.

2 . The fluid impingement cooling assembly for at least one semiconductor device of claim 1 , further comprising:

a chamber divider separating the inlet chamber and the outlet chamber.

3 . The fluid impingement cooling assembly for at least one semiconductor device of claim 2 , wherein at least a portion of the chamber divider is perpendicular to the plate.

4 . The fluid impingement cooling assembly for at least one semiconductor device of claim 2 , wherein the chamber divider is coupled to the plate and configured to be received within the heat exchange base together with the plate.

5 . The fluid impingement cooling assembly for at least one semiconductor device of claim 1 , wherein:

the inlet connection is in fluid connection with the inlet chamber and positioned to direct a first fluid flow in a first direction into the inlet chamber, and thereby through the first nozzle and into the outlet chamber; and

the outlet connection is in fluid connection with the outlet chamber and positioned to receive a second fluid flow in a second direction from the outlet chamber, the second direction being different from the first direction.

6 . The fluid impingement cooling assembly for at least one semiconductor device of claim 5 , wherein the second direction is opposite of the first direction or perpendicular to the first direction.

7 . The fluid impingement cooling assembly for at least one semiconductor device of claim 1 , wherein the heat exchange base is configured to receive at least one semiconductor device with a frontside facing away from the inlet chamber and a backside facing the plate, wherein the first nozzle is positioned on the plate to cause fluid impingement of fluid flow from the inlet chamber through the first nozzle and onto the backside of the at least one semiconductor device.

8 . The fluid impingement cooling assembly for at least one semiconductor device of claim 7 , wherein a fluid flow path is defined from the inlet connection to the inlet chamber, through the first nozzle, onto the backside of the at least one semiconductor device, through at least one return channel and thereby to the outlet chamber, and from the outlet chamber through the outlet connection.

9 . The fluid impingement cooling assembly for at least one semiconductor device of claim 1 , wherein the plate is interchangeable with a second plate.

10 . The fluid impingement cooling assembly for at least one semiconductor device of claim 1 , wherein the first nozzle is formed within a raised surface that is raised from a surface of the plate by at least one pedestal wall connecting the plate to the raised surface, and further wherein a return path from the first nozzle to the outlet chamber is defined by the at least one pedestal wall.

11 . A plate assembly for fluid impingement cooling of a semiconductor device, comprising:

a plate configured to be received within a heat exchange base; and

a first pedestal coupled to the plate and having a first nozzle formed therein,

wherein the plate, when received within the heat exchange base, defines a fluid flow path from an inlet chamber of the heat exchange base through the first nozzle to an outlet chamber of the heat exchange base, and

wherein the first pedestal is removable from the plate and interchangeable with a second pedestal having a second nozzle of a different size than the first nozzle.

12 . The plate assembly for fluid impingement cooling of a semiconductor device of claim 11 , wherein the first pedestal includes a raised surface that is raised from a surface of the plate by at least one pedestal wall connecting the plate to the raised surface, and wherein a return path from the first nozzle to the outlet chamber is defined by the at least one pedestal wall.

13 . The plate assembly for fluid impingement cooling of a semiconductor device of claim 11 , wherein the plate is configured to be coupled to at least one wall of the heat exchange base, and to a chamber divider separating the inlet chamber and the outlet chamber when the plate is received within the heat exchange base.

14 . The plate assembly for fluid impingement cooling of a semiconductor device of claim 13 , wherein at least a portion of the chamber divider is perpendicular to the plate.

15 . The plate assembly for fluid impingement cooling of a semiconductor device of claim 13 , wherein the chamber divider is coupled to the plate and configured to be received within the heat exchange base together with the plate.

16 . The plate assembly for fluid impingement cooling of a semiconductor device of claim 11 , wherein the plate is interchangeable with a second plate within the heat exchange base.

17 . A method of making a fluid impingement cooling assembly for semiconductor devices, comprising:

providing a heat exchange base having an inlet chamber and an outlet chamber;

providing an inlet connection in fluid connection with the inlet chamber;

providing an outlet connection in fluid connection with the outlet chamber; and

providing a plate configured to be coupled to the inlet chamber, including forming the plate with an opening configured to be coupled to any of at least two interchangeable pedestals, including a first pedestal having a first nozzle and a second pedestal having a second nozzle.

18 . The method of claim 17 , further comprising:

providing the first pedestal with a raised surface that is raised from a surface of the plate by at least one pedestal wall connecting the plate to the raised surface.

19 . The method of claim 17 , further comprising:

providing the plate coupled to at least one wall of the heat exchange base, and to a chamber divider separating the inlet chamber and the outlet chamber when the plate is received within the heat exchange base.

20 . The method of claim 17 , further comprising:

providing an inlet connection in fluid connection with the inlet chamber and positioned to direct a first fluid flow in a first direction into the inlet chamber, and thereby through the first nozzle and into the outlet chamber; and

providing an outlet connection in fluid connection with the outlet chamber and positioned to receive a second fluid flow in a second direction from the outlet chamber, the second direction being different from the first direction.