Patent Application
Provisional
App. No. 60/669,585
· Confirmation No. 3749
Integrated circuit package system using heat slug
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-05-25 | CFILE |
Request for Corrected Filing Receipt | 4 | View | |
| 2005-05-25 | ADS |
Application Data Sheet | 3 | View | |
| 2005-04-09 | TRNA |
Transmittal of New Application | 2 | View | |
| 2005-04-09 | SPEC |
Specification | 9 | View | |
| 2005-04-09 | ABST |
Abstract | 1 | View | |
| 2005-04-09 | DRW |
Drawings-only black and white line drawings | 2 | View | |
| 2005-04-09 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Kyungsic Yu
Seoul, KOREA, REPUBLIC OF
Tae Keun Lee
Kyungki-do, KOREA, REPUBLIC OF
Youngnam Choi
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-136P
- Confirmation No.
- 3749
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/669,585
- Filed
- 2005-04-09
External Links