Multipackage module having stacked packages with asymmetrically arranged die and molding

Inventor: Hyeog Chan Kwon

Provisional Application Expired

	Code	Description	Pages	PDF
2005-04-11	`TRNA`	Transmittal of New Application	1	View
2005-04-11	`SPEC`	Specification	7	View
2005-04-11	`CLM`	Claims	1	View
2005-04-11	`ABST`	Abstract	1	View
2005-04-11	`DRW`	Drawings-only black and white line drawings	3	View
2005-04-11	`WFEE`	Fee Worksheet (SB06)	1	View
2005-04-11	`ADS`	Application Data Sheet	2	View

Inventors

Hyeog Chan Kwon Seoul, KOREA, REPUBLIC OF

Attorneys & Agents of Record

KORBIN VAN DYKE Reg. 52313 Agent

ANDREW DUNLAP Reg. 60554 Attorney · WENDEROTH, LIND & PONACK, L.L.P.

HANNAH POWELL Reg. 84418 Agent · HAYNES BEFFEL & WOLFELD LLP

MARK HAYNES Reg. 30846 Attorney · HAYNES BEFFEL & WOLFELD LLP

FRANKLIN SCHELLENBERG Reg. 47315 Agent

WARREN WOLFELD Reg. 31454 Attorney · HAYNES BEFFEL & WOLFELD LLP

ERNEST BEFFEL Reg. 43489 Attorney · HAYNES BEFFEL & WOLFELD, LLP

JASON LIAO Reg. 59382 Agent

PAUL DURDIK Reg. 37819 Attorney · HAYNES BEFFEL AND WOLFELD LLP

Prosecution

STATS CHIPPAC LTD.

from KWON, HYEOG CHAN

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded 2006-05-16

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