Patent Application
Provisional
App. No. 60/766,380
· Confirmation No. 1380
SEMICONDUCTOR WAFER LEVEL PACKAGE SYSTEM
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2006-01-13 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2006-01-13 | SPEC |
Specification | 6 | View | |
| 2006-01-13 | TRNA |
Transmittal of New Application | 2 | View | |
| 2006-01-13 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2006-01-13 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2006-01-13 | ABST |
Abstract | 1 | View | |
| 2006-01-13 | ADS |
Application Data Sheet | 3 | View | |
| 2006-01-13 | CLM |
Claims | 1 | View |
Inventors
Hyung Jun Jeon
Seoul, KOREA, REPUBLIC OF
Tae Keun Lee
Ichon-si, KOREA, REPUBLIC OF
Young Chan Ko
Ichon-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-243P
- Confirmation No.
- 1380
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/766,380
- Filed
- 2006-01-13
External Links