Patent Application
Provisional
App. No. 60/766,599
· Confirmation No. 1599
WAFER LEVEL PACKAGE SYSTEM
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2006-01-31 | ADS |
Application Data Sheet | 3 | View | |
| 2006-01-31 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2006-01-31 | TRNA |
Transmittal of New Application | 2 | View | |
| 2006-01-31 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2006-01-31 | CLM |
Claims | 1 | View | |
| 2006-01-31 | SPEC |
Specification | 8 | View | |
| 2006-01-31 | ABST |
Abstract | 1 | View | |
| 2006-01-31 | DRW |
Drawings-only black and white line drawings | 6 | View |
Inventors
Koo Hong Lee
Seoul, KOREA, REPUBLIC OF
II Kwon Shim
Singapore, SINGAPORE
Young Cheol Kim
Yongin-si, KOREA, REPUBLIC OF
Bongsuk Choi
Ichon-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-250P
- Confirmation No.
- 1599
No recorded assignments found.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/766,599
- Filed
- 2006-01-31
External Links