IP Library › Patent Application 61117211
Patent Application Provisional
App. No. 61/117,211 · Confirmation No. 3961

Fan-out Wafer Level Chip Scale Package with Multi Die Attach

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2008-12-03 APP.FILE.REC Filing Receipt 3 View
2008-11-23 TR.PROV Provisional Cover Sheet (SB16) 4 View
2008-11-23 WFEE Fee Worksheet (SB06) 2 View
2008-11-23 N417 Electronic Filing System Acknowledgment Receipt 2 View
2008-11-23 SPEC Specification 10 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
61/117,211
Filed
2008-11-23