Patent Application
Provisional
App. No. 63/001,218
· Confirmation No. 2832
New Thermal Solution Using Solder and Sputtering
Applicant:
STATS ChipPAC Pte. Ltd.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-04-20 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2020-04-10 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2020-04-10 | R3.73 |
Assignee showing of ownership per 37 CFR 3.73 | 2 | View | |
| 2020-04-10 | PA.. |
Power of Attorney | 1 | View | |
| 2020-03-27 | TR.PROV |
Provisional Cover Sheet (SB16) | 4 | View | |
| 2020-03-27 | ADS |
Application Data Sheet | 9 | View | |
| 2020-03-27 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2020-03-27 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2020-03-27 | SPEC |
Specification | 5 | View | |
| 2020-03-27 | ABST |
Abstract | 1 | View |
Inventors
Dong Won Son
Incheon si, KOREA, REPUBLIC OF
Byeonghoon Kim
Seoul, KOREA, REPUBLIC OF
Sung Ho Choi
Incheon si, KOREA, REPUBLIC OF
Sung Jae Lim
Incheon, KOREA, REPUBLIC OF
Jong Ho Shin
Gyenggi-do, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 112165
- Docket No.
- 2515.0524
- Confirmation No.
- 2832
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2020-04-09
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Quick Facts
- App. No.
- 63/001,218
- Filed
- 2020-03-27
External Links