IP Library Patent Application 63199873
Patent Application Provisional
App. No. 63/199,873 · Confirmation No. 1130

LEAD FRAMES FOR SEMICONDUCTOR PACKAGES WITH INCREASED RELIABILITY AND RELATED SEMICONDUCTOR DEVICE PACKAGES AND METHODS

Inventor: Behrooz Mehr
Provisional Application Expired
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Code Description Pages PDF
2021-02-09 APP.FILE.REC Filing Receipt 3 View
2021-01-29 N417.PYMT Electronic Fee Payment View
2021-01-29 N417 Electronic Filing System Acknowledgment Receipt View
2021-01-29 APPENDIX Appendix to the specification View
2021-01-29 SPEC Specification View
2021-01-29 CLM Claims View
2021-01-29 ABST Abstract View
2021-01-29 ADS Application Data Sheet View
2021-01-29 DRW Drawings-only black and white line drawings View
2021-01-29 SPEC Specification View
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Quick Facts
App. No.
63/199,873
Filed
2021-01-29