"assignee GLOBAL UNICHIP CORPORATION" — IP Library Search

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HETEROGENEOUS THERMAL INTERFACE MATERIAL ELEMENT AND PRESSING TEST DEVICE HAVING THE SAME

App. 19/021,092 Filed 2025-01-14 Publications -- Issue Fee Payment Received

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SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF

App. 18/945,571 Filed 2024-11-13 Docketed New Case - Ready for Examination

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TESTING APPARATUS AND ITS CONDUCTIVE TERMINAL

App. 18/945,457 Filed 2024-11-12 Non Final Action Mailed

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RESISTOR ARRAY CIRCUIT, DIGITAL-TO-ANALOG CONVERTER CIRCUIT AND LAYOUT METHOD OF THE SAME

App. 18/942,759 Filed 2024-11-10 Non Final Action Mailed

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TESTING APPARATUS OF PACKAGED MODULES AND ITS MANUFACTURING METHOD

App. 18/937,047 Filed 2024-11-05 Non Final Action Mailed

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WIRING SUBSTRATE

App. 18/923,719 Filed 2024-10-23 Non Final Action Mailed

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GENERATING DEVICE FOR SCAN CAPTURE CONSTRAINT AND GENERATING METHOD THEREOF

App. 18/796,210 Filed 2024-08-06 Docketed New Case - Ready for Examination

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INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE DEVICE

App. 18/786,595 Filed 2024-07-29 Docketed New Case - Ready for Examination

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SEMICONDUCTOR DEVICE, INTERFACE DEVICE AND OPERATION METHOD

App. 18/764,159 Filed 2024-07-04 Patented Case

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INTEGRATED CIRCUIT DEVICE AND ADAPTIVE POWER SCALING METHOD THEREOF

App. 18/764,174 Filed 2024-07-04 Docketed New Case - Ready for Examination

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