"assignee INGENTEC CORPORATION" — IP Library Search

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VERTICAL LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

App. 18/963,588 Filed 2024-11-28 Docketed New Case - Ready for Examination

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LIGHT EMITTING DIODE PIXEL PACKAGE AND MANUFACTURING METHOD FOR LIGHT EMITTING DIODE PIXEL PACKAGE

App. 18/920,963 Filed 2024-10-20 Docketed New Case - Ready for Examination

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LIGHT EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF

App. 18/914,260 Filed 2024-10-14 Docketed New Case - Ready for Examination

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DOUBLE-SIDED DISPLAY PIXEL PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

App. 18/887,987 Filed 2024-09-17 Docketed New Case - Ready for Examination

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MICRO-LED WAFER TESTING DEVICE AND MICRO-LED WAFER TESTING METHOD

App. 18/824,884 Filed 2024-09-04 Patented Case

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WAFER DEFECT ANALYZING DEVICE AND WAFER DEFECT ANALYZING METHOD

App. 18/744,727 Filed 2024-06-17 Patented Case

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EXAMINING METHOD FOR A COATING LAYER ON A WAFER

App. 18/531,237 Filed 2023-12-06 Abandoned -- Failure to Respond to an Office Action

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LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

App. 18/472,234 Filed 2023-09-22 Patented Case

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LASER DIODE AND LASER DIODE MANUFACTURING METHOD

App. 18/324,166 Filed 2023-05-26 Non Final Action Mailed

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ENCAPSULATION PROCESS METHOD FOR WAFER-LEVEL LIGHT-EMITTING DIODE DIES

App. 18/320,936 Filed 2023-05-19 Patented Case

Patent Order

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