"assignee STMicroelectronics PTE LTD" — IP Library Search

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LAMINATE PACKAGE LID TO PREVENT DELAMINATION

App. 19/297,436 Filed 2025-08-12 Docketed New Case - Ready for Examination

Patent Order

LAMINATE PACKAGE LID TO PREVENT DELAMINATION

App. 63/688,372 Filed 2024-08-29 Provisional Application Expired

Patent Order

MULTI-AXIS LASER DRILLING FOR WAFER-LEVEL PACKAGING

App. 18/733,373 Filed 2024-06-04 Non Final Action Mailed

Patent Order

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USING WIRE BONDING

App. 18/680,178 Filed 2024-05-31 Docketed New Case - Ready for Examination

Patent Order

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSITIONING APPARATUS

App. 18/616,929 Filed 2024-03-26 Docketed New Case - Ready for Examination

Patent Order

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

App. 18/607,215 Filed 2024-03-15 Docketed New Case - Ready for Examination

Patent Order

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

App. 18/607,211 Filed 2024-03-15 Docketed New Case - Ready for Examination

Patent Order

AIR-GAP IN TRENCH FIELD PLATE POWER MOSFET FOR REDUCED POWER LOSS PERFORMANCE

App. 18/590,785 Filed 2024-02-28 Response to Non-Final Office Action Entered and Forwarded to Examiner

Patent Order

PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

App. 18/489,746 Filed 2023-10-18 Final Rejection Mailed

Patent Order

POWER PACKAGE WITH COPPER PLATING AND MOLDING STRUCTURE

App. 18/352,962 Filed 2023-07-14 Docketed New Case - Ready for Examination

Patent Order

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