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195 results · page 1 of 20
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SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
App. 19/632,728
Filed 2026-03-30
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SEMICONDUCTOR DEVICE
App. 19/408,389
Filed 2025-12-04
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SEMICONDUCTOR PACKAGE AND METHOD
App. 19/381,275
Filed 2025-11-06
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
App. 19/289,133
Filed 2025-08-04
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PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING A STEP REGION AND METHOD OF MAKING THE SAME
App. 19/286,386
Filed 2025-07-31
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HEAT DISSIPATION FOR INTEGRATED CIRCUIT PACKAGE
App. 19/280,726
Filed 2025-07-25
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ADHESION OF A PACKAGE COMPONENT TO A HEAT SINK
App. 19/279,258
Filed 2025-07-24
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CHIP PACKAGE STRUCTURE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME
App. 19/268,329
Filed 2025-07-14
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. 19/246,733
Filed 2025-06-24
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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
App. 19/241,425
Filed 2025-06-18
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Inventor — page 1 of 20
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