"inventor Li-Lin Su" — IP Library Search

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INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS

App. 18/749,812 Filed 2024-06-21 Docketed New Case - Ready for Examination

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MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH VOIDS

App. 18/514,254 Filed 2023-11-20 Patented Case

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ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATURE

App. 63/404,730 Filed 2022-09-08 Provisional Application Expired

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Multi-Metal Fill with Self-Aligned Patterning and Dielectric with Voids

App. 17/868,398 Filed 2022-07-19 Patented Case

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Integrated Circuit Interconnect Structures with Air Gaps

App. 17/665,703 Filed 2022-02-07 Patented Case

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Copper Contact Plugs with Barrier Layers

App. 16/904,026 Filed 2020-06-17 Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362

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MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH VOIDS

App. 16/722,621 Filed 2019-12-20 Patented Case

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Integrated Circuit Interconnect Structures with Air Gaps

App. 16/380,386 Filed 2019-04-10 Patented Case

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Inter-Metal Structures and Methods of Forming the Same

App. 62/691,809 Filed 2018-06-29 Provisional Application Expired

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STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE

App. 15/691,035 Filed 2017-08-30 Patented Case

Patent Order

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