Patent Assignment
Reel/Frame 004440/0823
Assignment of Assignors Interest.
Recorded: 1985-08-15
Pages: 2
Assignors
CHU, SUNG G.
Executed: 1985-04-16
JABLONER, HAROLD
Executed: 1985-04-16
SWETLIN, BRIAN J.
Executed: 1985-04-16
Assignee
Covered Property
(1)
Thermosetting Epoxy Resin Compositions and Thermosets Therefrom
Patent:
4,656,208 →
Application:
06/724,133 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 31, 2000
From: HERCULES INCORPORATED, A CORPORATION OF DELAWARE
To: HEXCEL CORPORATION, A CORPORATION OF DELAWARE
Reel/Frame 011072/0070 →
Security Interest
Feb 6, 2002
From: HEXCEL CORPORATION; HEXCEL INTERNATIONAL; HEXCEL OMEGA CORPORATION; HEXCEL BETA CORP.
To: CITIBANK, N.A.
Reel/Frame 012559/0343 →
Security Interest
Mar 26, 2003
From: HEXCEL CORPORATION
To: HSBC BANK USA, AS JOINT COLLATERIAL AGENT
Reel/Frame 013988/0215 →
Amendment No. 1 to Patent Security Agreement
Jul 10, 2003
From: HEXCEL CORPORATION
To: HSBC BANK USA, AS JOINT COLLATERAL AGENT
Reel/Frame 013791/0223 →
Release of Security Interest
Mar 17, 2005
From: CITIBANK, N.A.
To: HEXCEL CORPORATION, A CORP. OF DELAWARE; HEXCEL INTERNATIONAL, A CORP. OF CALIFORNIA; HEXCEL OMEGA CORPORATION, A CORP. OF CALIFORNIA; HEXCEL BETA CORPORATION, A CORP. OF DELAWARE
Reel/Frame 015908/0710 →
Release of Security Interest
Mar 17, 2005
From: HSBC BANK USA, NATIONAL ASSOCIATION (FORMERLY KNOWN AS HSBC BANK USA)
To: HEXCEL CORPORATION
Reel/Frame 015918/0532 →