Patent Assignment
Reel/Frame 005131/0481
Assignment of Assignors Interest.
Recorded: 1989-09-06
Pages: 2
Assignors
BARON, KENNETH S.
Executed: 1989-08-31
BRINKERHOFF, SUSAN M.
Executed: 1989-09-01
LEE, FRANK W.
Executed: 1989-09-01
MC KINNEY, STELLA M.
Executed: 1989-09-01
Assignee
HEXCEL CORPORATION
11555 DUBLIN BLVD., DUBLIN, CALIFORNIA, 94566
Covered Property
(1)
Low Energy Cured Composite Repair System Based on Epoxy Resin with Imidazole Blocked Naphthyl Diisocyanate Catalyst Having Extended Shelf Life
Patent:
5,086,149 →
Application:
07/377,087 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 21, 1995
From: HEXCEL CORPORATION
To: CITICORP USA, INC.
Reel/Frame 007340/0262 →
Merger and Change of Name
Apr 10, 1995
From: HEXCEL CORPORATION, A CA CORP.
To: HEXCEL CORPORATION, A DE CORP.
Reel/Frame 007470/0154 →
Release of Patent Security Agreement
Mar 15, 1996
From: CITICORP USA, INC.
To: HEXCEL CORPORATION
Reel/Frame 007833/0483 →