IP Library › Assignment 007340/0262
Patent Assignment
Reel/Frame 007340/0262

Security Interest

Recorded: 1995-02-21 Pages: 18
Assignor
HEXCEL CORPORATION
Executed: 1995-02-08
Assignee
CITICORP USA, INC.
399 PARK AVENUE, NEW YORK, NEW YORK, 10022
Covered Properties (65)
Title Not Available
Application: 05/909,072 →
Electrically Conductive Prepreg Materials
Patent: 4,234,648 →
Application: 06/007,096 →
Kneadable Mastic Composition Comprised of Epoxy Resin and Aromatic Diamine Curing Agent
Patent: 4,269,751 →
Application: 06/019,266 →
Prepreg Material Having Increased Surface Tack
Patent: 4,329,387 →
Application: 06/075,763 →
Support for Curved Surfaces
Patent: 4,305,559 →
Application: 06/084,953 →
Packaging of Mutually Substances
Patent: 4,289,233 →
Application: 06/085,128 →
Chromatographic Apparatus and Method of Operation
Patent: 4,305,275 →
Application: 06/153,713 →
Vibratory Treatment Apparatus and Method
Patent: 4,352,570 →
Application: 06/161,017 →
Electrically Conductive Prepreg Materials
Patent: 4,486,490 →
Application: 06/174,299 →
Kneadable Mastic Composition Comprised of Epoxy Resin and Aromatic Curing Agent
Patent: 4,360,456 →
Application: 06/208,471 →
Heterocyclic Multifunctional Amine Adducts and Curable Compositions Containing the Same
Patent: 4,427,802 →
Application: 06/286,897 →
Apparatus and Method to Maintain Positive Separation of Reactive Bands
Patent: 4,396,447 →
Application: 06/367,073 →
Heat Insulating Blanket
Patent: 4,522,673 →
Application: 06/373,757 →
Sheet Material, Process for Its Production and Its Use in the Production of a Composite Structure
Patent: 4,569,884 →
Application: 06/419,208 →
Method and Material for Securing Structure for Machining
Patent: 4,445,956 →
Application: 06/466,178 →
Single Package Epoxy Resin System
Patent: 4,533,715 →
Application: 06/530,106 →
Perimidene and Benzimidazole Derivatives Useful in Curable Composi- Tions
Patent: 4,599,413 →
Application: 06/561,796 →
Honeycomb Part with Densified Outer Periphery
Patent: 4,675,241 →
Application: 06/664,467 →
Polyimide Foam Precursor and Its Use in Reinforcing Open-Cell Materials
Patent: 4,824,874 →
Application: 06/905,718 →
Method for Multiple-End-Close-Set Uniform Density Parallel Weft Insertion and Products Thereof
Patent: 4,774,120 →
Application: 07/023,690 →
Formable Honeycomb Panel
Patent: 4,859,517 →
Application: 07/025,980 →
Modified Imidazole Latent Epoxy Resin Catalysts and Systems Comprising Them
Patent: 4,742,148 →
Application: 07/039,175 →
Composite Tooling
Patent: 4,859,528 →
Application: 07/128,382 →
Method and Apparatus for Making Biased Fabric
Patent: 4,907,323 →
Application: 07/168,294 →
Polyimide Foam Precursor and Its Use in Reinforcing Open-Cell Materials
Patent: 4,830,883 →
Application: 07/209,757 →
Polyimide Foam Precursor and Its Use in Reinforcing Open-Cell Materials
Patent: 4,806,573 →
Application: 07/209,760 →
Compositions and Process for Producing Foam Plastics
Patent: 4,918,110 →
Application: 07/243,383 →
Toughened Resin Systems for Composite Applications
Patent: 5,248,711 →
Application: 07/312,016 →
Multi-Layer Honeycomb Structure
Patent: 5,106,668 →
Application: 07/363,255 →
Ceramic Bodies of Controlled Porosity and Process for Making Same
Patent: 5,017,522 →
Application: 07/377,085 →
Low Energy Cured Composite Repair System Based on Epoxy Resin with Imidazole Blocked Naphthyl Diisocyanate Catalyst Having Extended Shelf Life
Patent: 5,086,149 →
Application: 07/377,087 →
Densified Polyethersulfone
Patent: 4,945,154 →
Application: 07/377,116 →
Ceramic Reinforced Glass Matrix
Patent: 5,147,721 →
Application: 07/377,165 →
Toughened, High Temperature Resin Matrix System
Patent: 5,045,609 →
Application: 07/377,166 →
Thermoplastic Honeycomb and Methods of Preparation
Application: 07/404,240 →
Compositions and Process for Producing Foam Plastics
Patent: 4,939,019 →
Application: 07/436,834 →
Method and Apparatus for Impregnating Fibers with Highly Viscous Materials and Article Made Therewith
Patent: 5,573,813 →
Application: 07/487,554 →
Woven Core Structure
Patent: 5,128,195 →
Application: 07/492,509 →
A Method for Producing a Fiber-Reinforced Ceramic Honeycomb Panel
Patent: 5,078,818 →
Application: 07/510,510 →
Cyanate Resin-Based Foams
Patent: 5,077,319 →
Application: 07/524,868 →
Continuous Process for the Preparation of Thermoplastic Honeycomb
Patent: 5,139,596 →
Application: 07/531,184 →
Polyurethanes of Improved Characteristics Biocompatible Urea-Modified Polyurethane from Castor Oil
Patent: 4,990,586 →
Application: 07/554,964 →
Process for the Preparation of Thermoplastic Honeycomb Shaped Structures Without Machining
Patent: 5,252,163 →
Application: 07/620,880 →
Continuous Process for the Preparation of Unitary Thermoplastic Honeycomb Containing Areas with Different Physical Properties
Patent: 5,217,556 →
Application: 07/620,958 →
Reactive Polyimides for Addition to Thermosetting Resins, and Process for Preparation of Same
Patent: 5,104,970 →
Application: 07/630,730 →
Honeycomb of Fabric-Reinforced Polyimide Polymer
Patent: 5,260,117 →
Application: 07/667,909 →
Low Energy Cured Composite Repair System Based on Imidazole-Blocked Nephthyl-Diisocyanates
Patent: 5,145,541 →
Application: 07/714,827 →
Resin Systems of Improved Toughness and High Temperature Performance and Method Therefor
Patent: 5,278,224 →
Application: 07/744,562 →
Foam Filled Honeycomb and Methods for Their Production
Patent: 5,338,594 →
Application: 07/832,401 →
Process for the Preparation of Thermoplastic Sandwich Structures
Application: 07/844,547 →
High Thermal Conductivity Non-Metallic Honeycomb
Patent: 5,288,537 →
Application: 07/853,957 →
Apparatus for the Preparation of Thermoplastic Honeycomb
Patent: 5,312,511 →
Application: 07/873,255 →
Composite Material with Shrinkage Barrier
Patent: 5,391,425 →
Application: 07/922,629 →
High Modulus Fiber Protective Carrier Systems and Methods for Their Use
Patent: 5,380,576 →
Application: 08/006,504 →
Continuous Process for the Preparation of Unitary Thermoplastic Honeycomb Containing Areas with Different Physical Properties
Patent: 5,543,199 →
Application: 08/022,569 →
Materials and Processes for Fabricating Formed Composite Articles and Use in Shoe Arch
Patent: 5,401,564 →
Application: 08/036,182 →
Expansion Joint
Patent: 5,357,727 →
Application: 08/091,872 →
Method for Making Thermally Fused Thermoplastic Honeycomb Structures
Patent: 5,421,935 →
Application: 08/105,763 →
Process for the Preparation of Thermoplastic Sandwich Structures
Patent: 5,316,604 →
Application: 08/120,028 →
High Thermal Conductivity Non-Metallic Honeycomb with Laminated Cell Walls
Patent: 5,466,507 →
Application: 08/136,957 →
High Thermal Conductivity Non-Metallic Honeycomb with Optimum Pitch Fiber Angle
Patent: 5,470,633 →
Application: 08/136,958 →
High Thermal Conductivity Triaxial Non-Metallic Honeycomb
Patent: 5,527,584 →
Application: 08/139,309 →
High Thermal Conductivity Non-Metallic Honeycomb
Patent: 5,498,462 →
Application: 08/221,833 →
Fiber Reinforced Polyimide Honeycomb for High Temperature Applications
Patent: 5,514,444 →
Application: 08/261,377 →
High Modulus Reinforcement and Method for Handling Same
Application: 08/289,897 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Jan 12, 1981
From: FIRTH FRANCIS G.
To: APPLIED PLASTICS CO., INC., D/B/A, BIGGS COMPANY THE
Reel/Frame 003826/0431 →
Assignment of Assignors Interest. Apr 9, 1982
From: FIRTH, FRANCIS G.
To: APPLIED PLASTICS CO., INC.
Reel/Frame 003987/0954 →
Assignment of Assignors Interest. Aug 2, 1982
From: CIRISCIOLI, PETER R.
To: LEAR FAN CORP. (U.S.A.)
Reel/Frame 004027/0001 →
Assignment of Assignors Interest. Aug 2, 1982
From: FELL, BARRY M.
To: HEXCEL CORPORATION
Reel/Frame 004027/0003 →
Assignment of Assignors Interest. Jan 31, 1983
From: WEINAND, G.; BOTMAN, J. P.; BUSCH, R.
To: HEXCEL CORPORATION
Reel/Frame 004089/0063 →
Assignment of Assignors Interest. Feb 14, 1983
From: FREEMAN, BOB L.; BORRIS, PETER W.
To: HEXCEL CORPORATION, A CORPOF CA.
Reel/Frame 004093/0464 →
Assignment of Assignors Interest. Nov 2, 1983
From: MOULTON, RICHARD J.; NEUNER, JOHN D.
To: HEXCEL CORPORATION
Reel/Frame 004186/0153 →
Assignment of Assignors Interest. Dec 7, 1984
From: HULL, HAROLD R.
To: HEXCEL CORPORATION, A CORP OF CA
Reel/Frame 004369/0467 →
Assignment of Assignors Interest. Apr 1, 1985
From: APPLIED PLASTICS CO., INC. A CA CORP
To: HEXCEL CORPORATION
Reel/Frame 004380/0118 →
Assignment of Assignors Interest. Apr 17, 1985
From: LEE, FRANK W. C.; BARON, KENNETH S.
To: HEXCEL CORPORATION, 650 CALIFORNIA STREET, SAN FRANCISCO, CA. 94108
Reel/Frame 004444/0094 →
Assignment of Assignors Interest. Nov 23, 1987
From: VEES, FREDERICK; FIEDLER, MICHAEL T.
To: XERKON, INC., 1005 BERKSHIRE LANE, MINNEAPOLIS, MN 55441
Reel/Frame 004796/0385 →
Assignment of Assignors Interest. Nov 23, 1987
From: XERKON, INC.
To: KNYTEX, INC., 7901 XERXES AVENUE SOUTH, MINNEAPOLIS, MINNESOTA 55431, A MN CORP.
Reel/Frame 004796/0454 →
Assignment of Assignors Interest. Feb 9, 1988
From: LEE, FRANK W.; BARON, KENNETH S.
To: HEXCEL CORPORATION
Reel/Frame 004834/0376 →
Assignment of Assignors Interest. Oct 17, 1988
From: LEE, FRANK W.; NEUNER, JON D.; BARON, KENNETH
To: HEXCEL CORPORATION, 11711 DUBLIN BOULEVARD, DUBLIN, CA. 94566
Reel/Frame 004993/0189 →
Assignment of Assignor's Interest Nov 9, 1988
From: SMITH, DONALD L.; HICKS, J. R.; MCDONALD, CURTIS L.
To: HEXCEL CORPORATION
Reel/Frame 007439/0389 →
Assignment of Assignor's Interest Nov 9, 1988
From: HICKS, J. R.; MCDONALD, CURTIS L.; SMITH, DONALD L.
To: HEXCEL CORPORATION
Reel/Frame 007439/0598 →
Merger and Change of Name Apr 10, 1995
From: HEXCEL CORPORATION, A CA CORP.
To: HEXCEL CORPORATION, A DE CORP.
Reel/Frame 007470/0154 →
Assignment of Assignor's Interest Nov 13, 1995
From: HEXCEL CORPORATION
To: FIBER-RESIN CORP.
Reel/Frame 007732/0852 →
Release of Security Interest Nov 13, 1995
From: CITICORP USA, INC.
To: HEXCEL CORPORATION
Reel/Frame 007709/0012 →
Release of Patent Security Agreement Mar 15, 1996
From: CITICORP USA, INC.
To: HEXCEL CORPORATION
Reel/Frame 007833/0483 →
Change of Name Aug 5, 1996
From: KNYTEX, INC.
To: HEXCEL CORPORATION
Reel/Frame 008067/0511 →
Security Interest Feb 6, 2002
From: HEXCEL CORPORATION; HEXCEL INTERNATIONAL; HEXCEL OMEGA CORPORATION; HEXCEL BETA CORP.
To: CITIBANK, N.A.
Reel/Frame 012559/0343 →
Security Interest Mar 26, 2003
From: HEXCEL CORPORATION
To: HSBC BANK USA, AS JOINT COLLATERIAL AGENT
Reel/Frame 013988/0215 →
Amendment No. 1 to Patent Security Agreement Jul 10, 2003
From: HEXCEL CORPORATION
To: HSBC BANK USA, AS JOINT COLLATERAL AGENT
Reel/Frame 013791/0223 →
Security Agreement Mar 1, 2005
From: HEXCEL CORPORATION; HEXCEL REINFORCEMENT CORPORATION
To: DEUTSCHE BANK TRUST COMPANY AMERICAS
Reel/Frame 015810/0600 →