IP Library Assignment 004444/0094
Patent Assignment
Reel/Frame 004444/0094

Assignment of Assignors Interest.

Recorded: 1985-04-17 Pages: 2
Assignors
LEE, FRANK W. C.
Executed: 1985-08-15
BARON, KENNETH S.
Executed: 1985-08-15
Assignee
Covered Property (1)
Single Package Epoxy Resin System
Patent: 4,533,715 →
Application: 06/530,106 →
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 21, 1995
From: HEXCEL CORPORATION
To: CITICORP USA, INC.
Reel/Frame 007340/0262 →
Merger and Change of Name Apr 10, 1995
From: HEXCEL CORPORATION, A CA CORP.
To: HEXCEL CORPORATION, A DE CORP.
Reel/Frame 007470/0154 →
Release of Patent Security Agreement Mar 15, 1996
From: CITICORP USA, INC.
To: HEXCEL CORPORATION
Reel/Frame 007833/0483 →
Security Interest Feb 6, 2002
From: HEXCEL CORPORATION; HEXCEL INTERNATIONAL; HEXCEL OMEGA CORPORATION; HEXCEL BETA CORP.
To: CITIBANK, N.A.
Reel/Frame 012559/0343 →
Amendment No. 1 to Patent Security Agreement Jul 10, 2003
From: HEXCEL CORPORATION
To: HSBC BANK USA, AS JOINT COLLATERAL AGENT
Reel/Frame 013791/0223 →
Release of Security Interest Mar 17, 2005
From: CITIBANK, N.A.
To: HEXCEL CORPORATION, A CORP. OF DELAWARE; HEXCEL INTERNATIONAL, A CORP. OF CALIFORNIA; HEXCEL OMEGA CORPORATION, A CORP. OF CALIFORNIA; HEXCEL BETA CORPORATION, A CORP. OF DELAWARE
Reel/Frame 015908/0710 →
Release of Security Interest Mar 17, 2005
From: HSBC BANK USA, NATIONAL ASSOCIATION (FORMERLY KNOWN AS HSBC BANK USA)
To: HEXCEL CORPORATION
Reel/Frame 015918/0532 →