Patent Assignment
Reel/Frame 005134/0232
Assignment of Assignors Interest.
Recorded: 1989-07-13
Pages: 1
Assignor
DO MINH, THAP
Executed: 1988-01-14
Assignee
EASTMAN KODAK COMPANY
A NJ CORP., ROCHESTER, NEW YORK
Covered Property
(1)
Laminate for the Formation of Beam Leads for Ic Chip Bonding Featuring Improved Positive-Working Resist
Patent:
4,865,950 →
Application:
07/146,632 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.