Patent Assignment
Reel/Frame 005779/0189
Assignment of Assignors Interest.
Recorded: 1991-07-25
Pages: 3
Assignors
LEIBOVITZ, JACQUES
Executed: 1991-01-03
COBARRUVIAZ, MARIA L.
Executed: 1991-01-03
SCHOLZ, KENNETH D.
Executed: 1991-01-04
CHAO, CLINTON C.
Executed: 1991-01-04
Assignee
HEWLETT-PACKARD COMPANY A CA CORPORATION
PALO ALTO, CALIFORNIA
Covered Property
(1)
Stacked Solid via Formation in Integrated Circuit Systems
Patent:
5,162,260 →
Application:
07/638,885 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.