Patent Assignment
Reel/Frame 006086/0695
Assignment of Assignors Interest.
Recorded: 1992-04-10
Pages: 2
Assignors
PINKER, RONALD D.
Executed: 1992-04-09
MERCHANT, STEVEN L.
Executed: 1992-04-09
ARNOLD, EMIL
Executed: 1992-04-09
Assignee
NORTH AMERICAN PHILIPS CORPORATION A DE CORPORATION
100 EAST 42ND STREET, NEW YORK, NEW YORK, 10017
Covered Property
(1)
Process for Making Thin Film Silicon-on-Insulator Wafers Employing Wafer Bonding and Wafer Thinning
Patent:
5,213,986 →
Application:
07/867,729 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 21, 2009
From: NORTH AMERICAN PHILIPS CORPORATION
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 022980/0424 →
Merger
Jul 21, 2009
From: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
To: FGP CORP.
Reel/Frame 022980/0428 →
Change of Name
Jul 21, 2009
From: FGP CORP.
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 022980/0433 →
Assignment of Assignor's Interest
Jul 21, 2009
From: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
To: NXP B.V.
Reel/Frame 022980/0441 →