IP Library › Assignment 022980/0441
Patent Assignment
Reel/Frame 022980/0441

Assignment of Assignor's Interest

Recorded: 2009-07-21 Pages: 6
Assignor
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, 5656 AG EINDHOVEN, NETHERLANDS
Covered Properties (19)
Selective Asperity Definition Technique Suitable for Use in Fabricating Floating-Gate Transistor
Patent: 5,008,212 →
Application: 07/283,340 →
Low Power Programming Circuit for User Programmable Digital Logic Array
Patent: 5,045,726 →
Application: 07/524,329 →
High Voltage Mos Transistor Having Shielded Crossover Path for a High Voltage Connection Bus
Patent: 5,040,045 →
Application: 07/525,288 →
Integrated Circuit Device Particularly Adapted for High Voltage Applications
Patent: 5,113,236 →
Application: 07/628,307 →
Electrically Erasable and Programmable Read-Only Memory with Source and Drain Regions Along Sidewalls of a Trench Structure
Patent: 5,278,438 →
Application: 07/810,250 →
Process for Making Thin Film Silicon-on-Insulator Wafers Employing Wafer Bonding and Wafer Thinning
Patent: 5,213,986 →
Application: 07/867,729 →
Selective Oxidation of Silicon Trench Sidewall
Patent: 5,240,875 →
Application: 07/929,086 →
Combination Driver-Summing Circuit for Rail-to-Rail Differential Amplifier
Patent: 5,311,145 →
Application: 08/036,774 →
Processor with Word-Aligned Branch Target in a Byte-Oriented Instruction Set
Patent: 5,590,358 →
Application: 08/308,337 →
Pre-Regulator with Light Switch to Limit Voltage Ringing on Turn-Off
Patent: 5,687,065 →
Application: 08/345,167 →
Method of Fabricating Non-Volatile Sidewall Memory Cell
Patent: 5,563,083 →
Application: 08/426,512 →
Low Noise Controller for Pulse Width Modulated Converters
Patent: 5,687,067 →
Application: 08/453,412 →
Cmos Process Utilizing Disposable Silicon Nitride Spacers for Making Lightly Doped Drain
Patent: 5,766,991 →
Application: 08/705,072 →
Electrically Erasable and Programmable Read Only Memory (Eeprom) Having Multiple Overlapping Metallization Layers
Patent: 5,751,038 →
Application: 08/753,554 →
Variable Gain Amplifier Using Impedance Network
Patent: 5,999,056 →
Application: 09/107,523 →
High Density Leaded Ball-Grid Array Package
Patent: 6,228,683 →
Application: 09/158,685 →
Method and circuit for reduced power consumption in a charge pump circuit
Patent: 6,304,147 →
Application: 09/535,948 →
Optimized Gate Implants for Reducing Dopant Effects During Gate Etching
Patent: 6,822,291 →
Application: 10/365,634 →
Publication: US 2003/0146472
Arrangement and method for providing power to a circuit using switched capacitor techniques
Application: 60/857,718 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Aug 21, 1992
From: TSUO, LEN-YUAN
To: NORTH AMERICAN PHILIPS CORPORATION, A CORP. OF DE
Reel/Frame 006252/0114 →
Assignment of Assignors Interest. Mar 25, 1993
From: HUIJSING, JOHAN H.; TERO, JOHN P.
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 006500/0086 →
Assignment of Assignor's Interest Nov 28, 1994
From: MIZRAHI-SHALOM, ORI K.; KO, KUNG-LING
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 007233/0629 →
Assignment of Assignor's Interest Nov 28, 1994
From: MAJID, NAVEED
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 007260/0901 →
Assignment of Assignor's Interest May 30, 1995
From: MAJID, NAVEED; WONG, STEPHEN L.
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 007506/0046 →
Assignment of Assignor's Interest Nov 26, 1996
From: MUKHERJEE, SATYENDRANATH
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 008279/0020 →
Assignment of Assignor's Interest Apr 9, 1997
From: MUKHERJEE, SATYENDRANATH
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 008443/0927 →
Assignment of Assignor's Interest Jun 30, 1998
From: FONG, KENG LEONG
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 009299/0132 →
Assignment of Assignor's Interest Mar 6, 2001
From: BONNOT, JEAN-LOUIS
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 011568/0542 →
Assignment of Assignor's Interest Jul 2, 2004
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: KONINKLIJKE PHILIPS ELECTRONICS N. V.
Reel/Frame 014814/0762 →
Assignment of Assignor's Interest Feb 17, 2009
From: NXP B.V.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 022266/0047 →
Merger Jul 21, 2009
From: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
To: FGP CORP.
Reel/Frame 022980/0428 →
Change of Name Jul 21, 2009
From: FGP CORP.
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 022980/0433 →
Change of Name Jul 21, 2009
From: NORTH AMERICAN PHILIPS CORPORATION
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 022980/0424 →
Assignment of Assignor's Interest Oct 20, 2011
From: CHEN, TEH-YI JAMES
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 027093/0812 →
Assignment of Assignor's Interest Nov 22, 2011
From: NXP B.V.
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 027265/0798 →
Assignment of Assignor's Interest Apr 8, 2014
From: NXP B.V.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032626/0262 →
Assignment of Assignor's Interest Aug 21, 2014
From: NXP B.V.
To: BROADCOM CORPORATION
Reel/Frame 033579/0267 →
Patent Security Agreement Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041708/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
Assignment of Assignor's Interest Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043951/0127 →
Change of Name Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0611 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →