Patent Assignment
Reel/Frame 006489/0356
Assignment of Assignors Interest.
Recorded: 1993-04-02
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, KWONSUN-KU, SUWEON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Vertical Mounting Device and Mounting Method
Patent:
5,579,987 →
Application:
08/013,348 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.