IP Library › Assignment 034151/0504
Patent Assignment
Reel/Frame 034151/0504

Assignment of Assignor's Interest

Recorded: 2014-11-04 Pages: 9
Assignor
SAMSUNG ELECTRONICS CO., LTD.
Executed: 2014-02-05
Assignee
INTELLECTUAL DISCOVERY CO., LTD.
10F GOLDEN TOWER BLDG., 511, SAMSEONG-RO, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (90)
Semiconductor Package Vertical Mounting Device and Mounting Method
Patent: 5,579,987 →
Application: 08/013,348 →
Apparatus for Conveying Circuit Boards Through a Component Mounting Station
Patent: 5,517,748 →
Application: 08/319,815 →
Sputtering Device
Patent: 5,536,381 →
Application: 08/359,658 →
Apparatus for Transferring Lead Frame
Patent: 5,653,575 →
Application: 08/555,752 →
Wafer Polishing Device
Patent: 5,735,731 →
Application: 08/606,194 →
Apparatus for Transporting Lead Frames
Patent: 5,987,722 →
Application: 08/608,249 →
Method of Attaching a Die Onto a Pad of a Lead Frame
Patent: 5,851,853 →
Application: 08/632,050 →
Die Bonding Apparatus with a Revolving Pick-Up Tool
Patent: 5,765,277 →
Application: 08/723,859 →
Stopper for Robot Rotary Articulation
Patent: 5,771,753 →
Application: 08/733,932 →
Semiconductor Chip Having a Bonding Window Smaller Than a Wire Ball
Patent: 5,898,226 →
Application: 08/770,248 →
Apparatus for Manufacturing a Semiconductor Device Having a Wafer Loading Stage with an Annular Slope
Patent: 5,843,237 →
Application: 08/773,338 →
Improved Wiring Between Semiconductor Integrated Circuit Chip Electrode Pads and a Surrounding Lead Frame
Patent: 5,923,092 →
Application: 08/773,679 →
Methods of Fabricating Borophosphosilicate Glass (Bpsg) Films Having Impurity Concentrations Which Remain Stable Over Time, and for Using Such Films Testing of Microelectronic Devices
Patent: 5,926,691 →
Application: 08/846,083 →
For Inhibiting the Formation of Air Pockets
Patent: 5,897,883 →
Application: 08/934,849 →
Semiconductor Device Packages Having Dummy Block Leads and the Bars with Extended Portions to Prevent Formation of Air Traps in the Encapsulate
Patent: 5,932,923 →
Application: 08/943,129 →
Semiconductor Die Bonding Apparatus Having Multiple Bonding System
Patent: 5,979,739 →
Application: 08/949,337 →
Methods of Forming Hemispherical Grained Silicon Electrodes Including Multiple Temperature Steps
Patent: 5,821,152 →
Application: 08/950,962 →
Brushless Motor for Driving Washing Machine
Patent: 5,920,137 →
Application: 08/969,673 →
Wafer Sawing Apparatus Having Washing Solution Spray and Suction Devices for Debris Removal and Heat Dissipation
Patent: 6,105,567 →
Application: 09/019,121 →
Support Table for Supporting a Module Board and Screen Printing Method Using the Same
Patent: 5,909,706 →
Application: 09/019,123 →
Wafer Fixing Unit for Focused Ion Beam Apparatus
Patent: 5,969,364 →
Application: 09/020,511 →
Mechanism for Preventing Metallic Ion Contamination of a Wafer in Ion Implantation Equipment
Patent: 5,977,553 →
Application: 09/034,328 →
Slurry Compositions for Polishing Wafers Used in Integrated Circuit Devices and Cleaning Compositions for Removing Electron Wax After Polishing
Patent: 5,972,863 →
Application: 09/041,274 →
Apparatus and Method for Manufacturing a Semiconductor Device Having Hemispherical Grains
Patent: 6,074,486 →
Application: 09/062,715 →
Method for Monitoring Defects of Semiconductor Device
Patent: 6,038,019 →
Application: 09/084,229 →
Printed Circuit Board and Chip-on-Board Packages Using Same
Patent: 6,104,095 →
Application: 09/087,903 →
Method of Manufacturing a Circuit Board Having Metal Bumps and a Semiconductor Device Package Comprising the Same
Patent: 6,041,495 →
Application: 09/087,929 →
Semiconductor Device Making Apparatus Using a Rotating Stopper
Patent: 6,087,623 →
Application: 09/094,076 →
Concentration Measuring Device of Electrophotographic Printer
Patent: 5,897,240 →
Application: 09/094,553 →
Apparatus and Method for Automatically Loading or Unloading Printed Circuit Boards for Semiconductor Modules
Patent: 6,062,799 →
Application: 09/103,518 →
Apparatus for Carrying Plural Printed Circuit Boards for Semiconductor Module
Patent: 5,927,504 →
Application: 09/103,641 →
Cleaning Compositions for Wafers Used in Semiconductor Devices and Methods of Using the Same
Patent: 5,883,060 →
Application: 09/108,890 →
Lead Frame Transfer Device and Wire Bonding Apparatus Comprising the Same
Patent: 6,053,234 →
Application: 09/123,426 →
A Semiconductor Device for a Avoiding Cracks in Insulating Spaces Between Metal Wiring Patterns
Patent: 5,998,872 →
Application: 09/137,934 →
Method of Stripping a Wafer of Its Film with Gas Injected into a Cvd Apparatus in Which the Wafer Is Disposed
Patent: 6,015,758 →
Application: 09/140,332 →
Stage Assembly of Microscope Which Prevent Its Particles of Wear from Being Dispersed
Patent: 5,969,857 →
Application: 09/148,635 →
Chip Scale Package
Patent: 6,037,662 →
Application: 09/154,665 →
Transfer Molding Apparatus with a Cull-Block Having Protrusion
Patent: 6,106,259 →
Application: 09/160,523 →
Air Intake Apparatus of Chemical Vapor Deposition Equipment Method for Removing Ozone Using the Same
Patent: 6,090,188 →
Application: 09/161,980 →
Method of Monitoring Ion-Implantation Process Using Photothermal Response from Ion-Implanted Sample, and Monitoring Apparatus of Ion-Implantation Process
Patent: 6,157,199 →
Application: 09/184,853 →
Method of Forming Capacitor of a Semiconductor Device and a Semiconductor Capacitor Formed Thereby
Patent: 5,981,351 →
Application: 09/184,856 →
Signal Transfer Apparatus of Computer
Patent: 6,538,785 →
Application: 09/206,289 →
Interconnect Structure with a Passivation Layer and Chip Pad
Patent: 6,303,999 →
Application: 09/209,644 →
Path Planning Apparatus and Method for Robots
Patent: 6,046,564 →
Application: 09/219,816 →
Dry Etching Apparatus for Manufacturing Semiconductor Devices
Patent: 6,179,955 →
Application: 09/317,138 →
Methods of Analyzing Water-Soluble Contaminants Generated During Microelectronic Device Manufacturing Processes
Patent: 6,176,120 →
Application: 09/330,972 →
Optical Recording and Reproducing Apparatus, Tilt Adjusting Method Appropriate Therefor, and Recording Control Method
Patent: 6,282,161 →
Application: 09/369,127 →
A Method of Preventing Cracks in Insulating Spaces Between Metal Wiring Patterns
Patent: 6,117,765 →
Application: 09/391,616 →
Modulated Signal Generator for W-Cdma Channel in a Wireless Local Loop System
Patent: 6,269,113 →
Application: 09/401,036 →
Microwave Oven Having a Microwave Detecting Device
Patent: 6,166,364 →
Application: 09/421,380 →
Microwave Oven
Patent: 6,268,597 →
Application: 09/480,692 →
Optical Fiber Preform Having Oh Barrier and Fabrication Method Thereof
Patent: 6,530,244 →
Application: 09/493,084 →
Apparatus and Method for Manufacturing a Semiconductor Device Having Hemisperical Grains
Patent: 6,673,673 →
Application: 09/519,661 →
Method of calculating a code value for electric power control according to temperature compensation in wireless communication terminal
Patent: 6,269,251 →
Application: 09/528,392 →
Portable Battery Charger Having a Separate Battery Pack
Patent: 6,265,845 →
Application: 09/578,318 →
Apparatus for Controlling the Temperature of a Wafer Located at a Pre-Alignment Stage
Patent: 6,370,793 →
Application: 09/584,551 →
Lead on Chip Type Semiconductor Package
Patent: 6,794,745 →
Application: 09/710,606 →
Frequency List Implemented Using a Plurality of Basic Frequencies and Bit Maps for Use in a Gsm System
Patent: 6,725,046 →
Application: 09/752,597 →
Publication: US 2001/0006894
Method for Manufactoring a Shiled for an Inductively-Couple Plasma Apparatus
Patent: 6,585,907 →
Application: 09/839,162 →
Publication: US 2001/0022157
Wafer Flat Zone Aligner
Patent: 6,382,901 →
Application: 09/847,346 →
Publication: US 2002/0034434
Die Bonding Equipment
Patent: 6,820,792 →
Application: 09/923,480 →
Publication: US 2001/0051394
Bumper Device for Automated Guided Vehicle
Patent: 6,739,635 →
Application: 09/939,697 →
Publication: US 2003/0006619
Method for Manufacturing a Semiconductor Device
Patent: 6,596,633 →
Application: 09/955,500 →
Publication: US 2002/0045338
Vertical Wafer Sawing Apparatus
Patent: 6,662,799 →
Application: 09/974,409 →
Publication: US 2002/0063115
Apparatus for Removing Wafer Ring Tape
Patent: 6,698,486 →
Application: 10/008,703 →
Publication: US 2002/0070302
Apparatus and Method for Rendering Web Page Html Data into a Format Suitable for Display on the Screen of a Wireless Mobile Station
Patent: 6,955,298 →
Application: 10/034,729 →
Publication: US 2003/0121983
Method for Fabricating Semiconductor Device and Forming Interlayer Dielectric Film Using High-Density Plasma
Patent: 6,617,259 →
Application: 10/140,286 →
Publication: US 2003/0008492
Automatic Guided System and Control Method Thereof
Patent: 6,493,614 →
Application: 10/155,131 →
Microwave Oven with Wave Distributing Device
Patent: 6,576,879 →
Application: 10/189,394 →
Publication: US 2003/0098302
Radioactive Image Apparatus and Focus Control Method Thereof
Patent: 6,830,376 →
Application: 10/282,070 →
Publication: US 2003/0223550
Semiconductor Chip Package with Direction-Flexible Mountability
Patent: 6,653,727 →
Application: 10/293,532 →
Publication: US 2003/0197263
Pressure Control Apparatus and Method of Establshing a Desired Level of Pressure Within at Least One Processing Chamber
Patent: 7,052,576 →
Application: 10/322,557 →
Publication: US 2003/0131792
Vacuum/Purge Operation of Loadlock Chamber and Method of Transferring a Wafer Using Said Operation
Patent: 6,843,809 →
Application: 10/422,793 →
Publication: US 2004/0083588
Furnace Temperature Detector
Patent: 6,837,619 →
Application: 10/442,143 →
Publication: US 2004/0004993
Waste Water Treatment System
Patent: 7,041,214 →
Application: 10/621,580 →
Publication: US 2004/0016703
Overhead Transport Apparatus
Patent: 7,107,911 →
Application: 10/635,523 →
Publication: US 2004/0107862
Semiconductor Package with Pattern Leads and Method for Manufacturing the Same
Patent: 7,061,125 →
Application: 10/667,474 →
Publication: US 2004/0155322
Coma Aberration Correcting Apparatus for Optical Pickup
Patent: 7,301,861 →
Application: 10/691,545 →
Publication: US 2004/0105360
Polishing Head and Chemical Mechanical Polishing Apparatus
Patent: 7,101,271 →
Application: 10/739,193 →
Publication: US 2004/0137832
Methods for Exposing Device Features on a Semiconductor Device
Patent: 7,211,460 →
Application: 10/960,660 →
Publication: US 2005/0079689
Lower Electrode Contact Structure and Method of Forming the Same
Patent: 7,022,569 →
Application: 11/000,943 →
Publication: US 2005/0095782
Apparatus and Method Using Vector Table Indirection to Maintain Forwarding Tables in a Router
Patent: 7,567,571 →
Application: 11/015,750 →
Publication: US 2005/0265307
Method of Exposing a Wafer to a Light, and Reticle, Reticle Assembly and Exposing Apparatus for Performing the Same
Patent: 7,265,818 →
Application: 11/023,231 →
Publication: US 2005/0140952
System to Determine Proper Wafer Alignment
Patent: 7,068,003 →
Application: 11/150,120 →
Publication: US 2006/0001395
Apparatus and Method for Setting a Gyroscrope Zero Point
Patent: 7,565,260 →
Application: 11/249,072 →
Publication: US 2007/0136019
Scanner Apparatus with Twin Substrate Stage, Semiconductor Photo Equipment with the Apparatus and Method of Manufacturing a Semiconductor Device Using the Equipment
Patent: 7,277,156 →
Application: 11/265,117 →
Publication: US 2006/0139591
Interface Device for Optical Recording and/or Reproducing Apparatus
Patent: 7,564,749 →
Application: 11/297,366 →
Publication: US 2006/0280054
System for Supplying Power for Peripheral Devices
Patent: 7,644,203 →
Application: 11/611,066 →
Publication: US 2008/0143185
Dust Sensing Unit for Use in Vacuum Cleaner
Patent: 7,562,414 →
Application: 11/903,966 →
Publication: US 2008/0250599
Composition for Removing a Photoresist, Method of Preparing the Composition, Method of Removing a Photoresist and Method of Manufacturing a Semiconductor Device Using the Composition
Patent: 7,687,448 →
Application: 12/564,077 →
Publication: US 2010/0009885
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Apr 2, 1993
From: LEE, KUG SANG; PARK, KHEE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 006489/0356 →
Assignment of Assignor's Interest Oct 7, 1994
From: PARK, JUN OK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 007181/0279 →
Assignment of Assignor's Interest Dec 20, 1994
From: LEE, JAE-HO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 007283/0982 →
Assignment of Assignor's Interest Feb 27, 1996
From: PARK, BOK SIK; CHO, SUNG HEE; KIM, DEONG GYU; LEE, YONG CHOUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 007900/0854 →
Assignment of Assignor's Interest Apr 15, 1996
From: LEE, HWA-YONG; JUN, JONG-KEUN; KIM, TAE-HYUK; LEE, JAE WON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 007967/0821 →
Assignment of Assignor's Interest May 9, 1996
From: LEE, BYOUNG-HUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 007963/0519 →
Assignment of Assignor's Interest May 13, 1996
From: PARK, BOK SIK; KIM DEOG GYU; CHO, SUNG HEE; LEE, YONG CHOUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 007962/0880 →
Assignment of Assignor's Interest Dec 11, 1996
From: JIN, HO TAE; HONG, SUNG BOK; ROH, JAE KY; CHOI, HEE KOOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008266/0021 →
Assignment of Assignor's Interest Dec 31, 1996
From: KWON, JUNG WOOK; OH, CHAN-SEOB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008288/0463 →
Assignment of Assignor's Interest Mar 12, 1997
From: JEONG, KI-KWON; SEOB, HYEONG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008408/0701 →
Assignment of Assignor's Interest Apr 28, 1997
From: CHUN, DANG-JUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008549/0091 →
Assignment of Assignor's Interest Jul 31, 1997
From: KANG, JE BONG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008634/0858 →
Assignment of Assignor's Interest Sep 22, 1997
From: CHO, CHANG HO; BAEK, JOONG HYUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008821/0804 →
Assignment of Assignor's Interest Oct 14, 1997
From: JIN, HO TAE; ROH, JAE KY; HONG, SUNG BOK; CHOI, HEE KOOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008857/0695 →
Assignment of Assignor's Interest Oct 20, 1997
From: LIM, KYU-HONG; KIM, BONG-SU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 008763/0675 →
Assignment of Assignor's Interest Mar 16, 1998
From: HAN, CHAN-HEE; YANG, CHANG-JIP; PARK, YOUNG-KYOU; KIM, JAE-WOOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009047/0953 →
Assignment of Assignor's Interest Mar 31, 1998
From: KIM, TAE HYEONG; RHO, HEE SUN; CHO, IN SIK; YOO, GI SU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009087/0730 →
Assignment of Assignor's Interest Apr 22, 1998
From: SUNG, BU-HYUN; LEE, MIN-SOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009137/0581 →
Assignment of Assignor's Interest May 26, 1998
From: CHANG, HWAN-SUK; MOON, HONG-BAE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009191/0195 →
Assignment of Assignor's Interest Jun 16, 1998
From: YUN, JONG YONG; MOON, SUNG HO; PARK, JONG JIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009260/0605 →
Assignment of Assignor's Interest Jun 22, 1998
From: SUN, YONG KYUN; JANG, SAM BOK; JANG, DONG SUNG; KANG, HYCON GU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009263/0018 →
Assignment of Assignor's Interest Jul 2, 1998
From: JEON, SANG-YOUNG; PARK, JONG-CHEL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009292/0163 →
Assignment of Assignor's Interest Jul 10, 1998
From: YANG, CHANG-JIP; HAN, CHAN-HEE; PARK, YOUNG-KYOU; KIM, JAE-WOOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009301/0154 →
Assignment of Assignor's Interest Aug 10, 1998
From: OH, SANG-GUEN; SOH, CHANG-EOB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009373/0634 →
Assignment of Assignor's Interest Jan 27, 1999
From: HEO, TAE-YEOL; PARK, JUNG-MIN; CHO, SUNG-HOON; KIM, GI-JUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 009712/0430 →