Polishing head and chemical mechanical polishing apparatus
View Patent ↗An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter.
1. A polishing head of a chemical mechanical polishing apparatus, comprising:
a membrane supporter, said membrane supporter having a guide groove;
a membrane having a fixing portion fixed to said membrane supporter, a pressure portion including a plurality of regions, and a partition portion extending from said pressure portion at a border between said plurality of regions;
a slider to which said partition portion of the membrane is fixed, said slider being received in said guide groove in the membrane supporter and being slidable relative to said membrane supporter within said guide groove between a first position at which said membrane is expanded, and a second position at which said membrane is contracted; and,
a first air chamber open to one of said plurality of regions of the pressure portion of said membrane at an outer peripheral portion of the membrane located to one side of said partition portion and a second air chamber open to another one of said plurality of regions of the pressure portion of said membrane located to the other side of said partition member, whereby different amounts of air pressure can be exerted on said plurality of regions of the pressure portion of said membrane via said first and second air chambers, respectively.
2. The polishing head of claim 1 , wherein said slider is disposed entirely within said guide groove when in said second position at which the membrane is contracted.
3. The polishing head of claim 1 , and further comprising a buffer interposed between said slider and an inner wall of said membrane supporter that defines the guide groove, and contacting said slider.
4. The polishing head of claim 3 , wherein said buffer is a member formed from a tetrafluoroethylene fluorocarbon compound and disposed in siding engagement with said slider.
5. The polishing head of claim 1 , wherein said slider has a groove in which said partition portion of the membrane is received, said groove having a lower portion and an upper portion extending from the lower portion, the upper portion of said groove having a cross section that is wider than that of the lower portion of said groove, and said partition portion of the membrane having complimentary first and second parts received in the lower portion and upper portions of the groove in said slider, respectively, whereby the partition portion of the membrane is fixed to said slider.
6. The polishing head of claim 1 , wherein said slider has a groove in which said partition portion of the membrane is received, and further comprising at least one fastener securing said partition member to said slider.
7. The polishing head of claim 1 , wherein said slider is formed from a tetrafluoroethylene fluorocarbon compound.
8. The polishing head of claim 1 , wherein said slider is annular.
9. A chemical mechanical polishing apparatus, comprising:
a platen;
a polishing pad adhered to the platen; and
a polishing head assembly disposed above said polishing pad and including a polishing head that urges a substrate against the polishing pad during a chemical mechanical polishing process, said polishing head including
a membrane supporter having a guide groove extending vertically therein,
a membrane having a fixing portion fixed to said membrane supporter, a pressure portion including a plurality of regions, and a partition portion extending upwardly from said pressure portion at a border between said plurality of regions;
a slider to which said partition portion of the membrane is fixed, said slider being received in said guide groove in the membrane supporter and being slidable vertically relative to said membrane supporter within said guide groove between a first position at which said membrane is expanded, and a second position at which said membrane is contracted; and,
a first air chamber open to one of said plurality of regions of the pressure portion of said membrane at an outer peripheral portion of the membrane located to one side of said partition portion, and a second air chamber open to another one of said plurality of regions of the pressure portion of said membrane located to the other side of said partition member, whereby different amounts of air pressure can be exerted on said regions of the pressure portion of said membrane via said first and second air chambers, respectively.
10. The apparatus of claim 9 , wherein said slider of the polishing head is disposed entirely within said guide groove when in said second position at which the membrane is contracted.
11. The apparatus of claim 9 , wherein said polishing head further comprises a buffer interposed between said slider and an inner wall of said membrane supporter that defines the guide groove, said buffer being disposed in contact with said slider.
12. The apparatus of claim 9 , wherein said slider of the polishing head has a groove in which said partition portion of the membrane is received, said groove having a lower portion and an upper portion extending from the lower portion, the upper portion of said groove having a cross section that is wider than that of the lower portion of said groove, and said partition portion of the membrane having complimentary first and second parts received in the lower portion and upper portions of the groove in said slider, respectively, whereby the partition portion of the membrane is fixed to said slider.
13. The apparatus of claim 9 , wherein said slider of the polishing head has a groove in which said partition portion of the membrane is received, and further comprising at least one fastener securing said partition member to said slider.
14. A polishing head adapted for use in a chemical mechanical polishing apparatus, comprising:
a membrane supporter, comprising a peripherally located clamp ring, a centrally located gimbal, and a guide groove located between the clamp ring and the gimbal;
a membrane comprising a first portion fixed to the clamp ring, a second portion fixed to the membrane supporter proximate the gimbal, a partition portion, and a pressure portion including a plurality of regions, wherein the membrane further comprises a front surface adapted to receive a wafer and back surface from which the partition portion extends to separate the plurality of regions; and,
a slider connected to the guide groove and adapted to slide relative to the membrane support from a first position when the membrane is expanded to a second position when the membrane is contracted and further adapted to fix the partition portion;
wherein the pressure portion is divided into a first pressure region between the first portion and the partition portion, and a second pressure region between the partition portion and the second portion.
15. The polishing head of claim 14 , wherein the slider is disposed entirely within the guide groove when the membrane is expanded.
16. The polishing head of claim 14 , further comprising a buffer interposed between the slider and an inner wall of the membrane supporter that defines the guide groove.
17. The polishing head of claim 16 , wherein the buffer is formed from a tetrafluoroethylene fluorocarbon compound and disposed in siding engagement with the slider.
18. The polishing head of claim 14 , wherein the slider has a groove in which the partition portion of the membrane is fixed, the groove having a lower portion and an upper portion extending from the lower portion.
19. The polishing head of claim 14 , wherein the slider comprises a groove adapted to receive the partition portion, and further comprising at least one fastener securing the partition portion to the slider.