IP Library Patent Application 10140286
Patent Application Utility
App. No. 10/140,286 · Confirmation No. 6600

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND FORMING INTERLAYER DIELECTRIC FILM USING HIGH-DENSITY PLASMA

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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Code Description Pages PDF
2003-07-16 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-16 LET. Miscellaneous Incoming Letter 1 View
2002-05-08 TRNA Transmittal of New Application 4 View
2002-05-08 A.PE Preliminary Amendment 3 View
2002-05-08 SPEC Specification 17 View
2002-05-08 CLM Claims 6 View
2002-05-08 ABST Abstract 1 View
2002-05-08 DRW Drawings-only black and white line drawings 8 View
2002-05-08 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
10/140,286
Filed
2002-05-08
Granted
2003-09-09
Pub. No.
US20030008492A1
Art Unit
2813
PTA
-120 days