Patent Assignment
Reel/Frame 012881/0443
Assignment of Assignor's Interest
Recorded: 2002-05-08
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWONG-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Semiconductor Device and Forming Interlayer Dielectric Film Using High-Density Plasma
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.