Assignment of Assignor's Interest

Recorded: 1997-07-31 Pages: 4

Assignor

KANG, JE BONG

Executed: 1997-03-26

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG, PALKAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Improved Wiring Between Semiconductor Integrated Circuit Chip Electrode Pads and a Surrounding Lead Frame

Patent: 5,923,092 →

Application: 08/773,679 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.