Patent Assignment
Reel/Frame 008857/0695
Assignment of Assignor's Interest
Recorded: 1997-10-14
Pages: 3
Assignors
JIN, HO TAE
Executed: 1997-10-02
ROH, JAE KY
Executed: 1997-10-02
HONG, SUNG BOK
Executed: 1997-10-02
CHOI, HEE KOOK
Executed: 1997-10-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Die Bonding Apparatus Having Multiple Bonding System
Patent:
5,979,739 →
Application:
08/949,337 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.