Assignment of Assignor's Interest

Recorded: 1996-05-09 Pages: 2

Assignor

LEE, BYOUNG-HUN

Executed: 1996-03-07

Assignee

SAMSUNG ELECTRONICS CO., LTD.

SUWON-CITY, 416, MAETAN-DONG, PALDAL-KU, KYUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Wafer Polishing Device

Patent: 5,735,731 →

Application: 08/606,194 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.