Assignment of Assignor's Interest

Recorded: 1996-12-11 Pages: 3

Assignors

JIN, HO TAE

Executed: 1996-10-26

HONG, SUNG BOK

Executed: 1996-10-26

ROH, JAE KY

Executed: 1996-10-26

CHOI, HEE KOOK

Executed: 1996-10-26

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Die Bonding Apparatus with a Revolving Pick-Up Tool

Patent: 5,765,277 →

Application: 08/723,859 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.