Assignment of Assignor's Interest

Recorded: 1996-04-15 Pages: 3

Assignors

LEE, HWA-YONG

Executed: 1996-03-26

JUN, JONG-KEUN

Executed: 1996-03-26

KIM, TAE-HYUK

Executed: 1996-03-26

LEE, JAE WON

Executed: 1996-03-26

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Method of Attaching a Die Onto a Pad of a Lead Frame

Patent: 5,851,853 →

Application: 08/632,050 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.